Infineon BSC N-Channel MOSFET, 381 A, 40 V N, 8-Pin TDSON BSC034N10LS5ATMA1

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RS庫存編號:
241-9969
製造零件編號:
BSC034N10LS5ATMA1
製造商:
Infineon
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品牌

Infineon

Product Type

MOSFET

Channel Type

N

Maximum Continuous Drain Current Id

381A

Maximum Drain Source Voltage Vds

40V

Package Type

TDSON

Series

BSC

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

0.7mΩ

Channel Mode

N

Forward Voltage Vf

1.1V

Maximum Gate Source Voltage Vgs

20V

Maximum Power Dissipation Pd

81W

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

80nC

Maximum Operating Temperature

+150°C

Standards/Approvals

RoHS

Automotive Standard

No

Infineon BSC Series MOSFET, 40V Maximum Drain Source Voltage, 381A Maximum Continuous Drain Current - BSC034N10LS5ATMA1


This MOSFET is a high-current N-channel device designed for power switching and conversion in surface-mount applications. It operates across an extended temperature range and is suitable for environments requiring robust thermal tolerance and low conduction losses. The component is presented in a TDSON package for board-mounted power stages and complies with RoHS.

Features and Benefits:


• 40V rating for intermediate-voltage power stages
• 381A continuous drain current for high-current delivery
• 0.7mΩ Rds(on) to reduce conduction losses
• 81W power dissipation for sustained thermal performance
• 80nC typical gate charge for predictable switching control
• Gate-source withstand up to 20V for flexible drive margins

Applications


• Suitable for high-current DC-DC converters in power supplies
• Ideal for synchronous rectification in switching regulators
• Used with motor drivers requiring low conduction loss
• Can be used for server power distribution modules
• Appropriate for industrial power management assemblies

What ambient temperatures can it withstand in operation?


It operates from -55°C up to +150°C, allowing use in wide-temperature environments.

How does the device help reduce heat in dense power systems?


The low drain-source resistance minimises I2R losses, lowering heat generation during conduction.

What mounting method is required for board assembly?


It is intended for surface mounting in a TDSON package to facilitate Compact power layouts.

How much forward voltage drop is typical under conduction?


The forward voltage is specified at 1.1V for conditions where Vgs and Id produce forward conduction.

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