Vishay SiHFPS37N50A Type N-Channel Power MOSFET, 36 A, 500 V Enhancement, 3-Pin Super-247

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RS庫存編號:
228-2855
製造零件編號:
SiHFPS37N50A-GE3
製造商:
Vishay
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品牌

Vishay

Product Type

Power MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

36A

Maximum Drain Source Voltage Vds

500V

Package Type

Super-247

Series

SiHFPS37N50A

Mount Type

Through Hole

Pin Count

3

Maximum Drain Source Resistance Rds

130mΩ

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

180nC

Forward Voltage Vf

1.5V

Maximum Gate Source Voltage Vgs

30V

Maximum Power Dissipation Pd

446W

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

150°C

Standards/Approvals

RoHS

Automotive Standard

No

Vishay SiHFPS37N50A Series Power MOSFET, 500V Drain Source Voltage, 36A Continuous Drain Current - SiHFPS37N50A-GE3


This power MOSFET is a high-voltage, N-channel enhancement device designed for switching and power-management roles in industrial and electronic systems. It is a through-hole component in a Super-247 package intended for applications where robust thermal handling and high drain-source voltage capability are needed. The device operates across a wide temperature range and is specified for continuous drain current and substantial power dissipation, making it suitable for demanding power-switching tasks.

Features and Benefits:


• 500V drain-source rating enabling high-voltage switching capability • 36 A continuous drain current supporting heavy load handling • 130 mΩ Rds(on) reducing conduction losses under load • 446W power dissipation improving thermal endurance in circuits • 180 nC typical gate charge facilitating predictable drive requirements • 30V maximum gate-source voltage providing common gate-drive margin

Applications


• Suitable for industrial inverter and motor-drive stages • Ideal for high-voltage power supplies and converters • Can be used for induction heating and welding power modules • Used with power rectification and switching arrays in automation • Suitable for gate-drive evaluation in power-electronics design

What are the thermal limits I should design for?


The device is rated to operate up to 150 °C maximum and down to -55 °C minimum, so thermal management should ensure junction temperature stays within that range under worst-case dissipation.

How should I approach gate-drive design for this component?


Expect a typical gate charge of 180 nC at the designated Vgs

design driver current and switching slope to control switching losses and EMI accordingly.

What package and mounting considerations apply?


It is supplied in a Super-247 through-hole package with three pins

ensure adequate PCB copper and heatsinking for the stated 446W dissipation to manage junction-to-ambient thermal resistance.

Are there specific voltage limitations for the gate?


The gate must not exceed a maximum gate-source voltage of 30V to prevent damage to the gate oxide.

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