Vishay Single 1 Type P-Channel MOSFET, 1.8 A, 400 V, 3-Pin TO-252 IRFR9310PBF

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RS庫存編號:
180-8772
製造零件編號:
IRFR9310PBF
製造商:
Vishay
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品牌

Vishay

Channel Type

Type P

Product Type

MOSFET

Maximum Continuous Drain Current Id

1.8A

Maximum Drain Source Voltage Vds

400V

Package Type

TO-252

Mount Type

Surface, Through Hole

Pin Count

3

Maximum Drain Source Resistance Rds

Maximum Gate Source Voltage Vgs

20V

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

50W

Typical Gate Charge Qg @ Vgs

13nC

Transistor Configuration

Single

Maximum Operating Temperature

150°C

Length

9.65mm

Standards/Approvals

RoHS-compliant

Number of Elements per Chip

1

Automotive Standard

No

COO (Country of Origin):
CN

Vishay MOSFET, 400V Drain Source Voltage, 50W Power Dissipation - IRFR9310PBF


This MOSFET is a P-channel transistor designed for high-voltage switching in power-electronic circuits. It is supplied in a TO-252 package and is suitable for surface-mount or through-hole assembly, offering a compact solution where a P-type device is required for high-voltage applications. The device operates across a wide temperature span and meets RoHS environmental standards.

Features and Benefits:


• 400V drain-to-source voltage for high-voltage switching capability
• 7Ω maximum Rds to limit conduction losses in low-current designs
• 13nC typical gate charge for fast gate-drive transitions
• 1.8A continuous drain current for moderate current requirements
• 50W maximum power dissipation for thermal headroom in power stages
• -55 to 150°C operating range for high-temperature deployment

Applications


• Suitable for high-voltage polarity protection circuits
• Ideal for P-channel high-side switching in power supplies
• Used with gate drivers requiring low gate-charge devices
• Can be used for industrial control electronics operating hot
• Appropriate for mixed-assembly boards combining surface-mount and through-hole components

What mounting options are available for fitting onto PCBs?


The device supports both surface-mount and through-hole mounting methods to accommodate varied board assembly practices.

How does the device perform under elevated ambient temperatures?


It is rated to operate up to 150°C, allowing use in designs exposed to high thermal stress when appropriate thermal management is applied.

What are the gate-drive voltage limits to consider during design?


The maximum gate-to-source voltage is ±20V, so gate-drive circuitry must constrain swings within this range.

Is this device composed of multiple elements on a single chip?


There is a single transistor element per chip, which simplifies current-sharing considerations in parallel arrangements.

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