TE Connectivity 0.5 mm Pitch 260 Way, Right Angle Surface Mount Mount SO DIMM Socket ,25.0 V, 500mA
- RS庫存編號:
- 185-5344
- Distrelec 貨號:
- 304-59-551
- 製造零件編號:
- 2309409-1
- 製造商:
- TE Connectivity
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- RS庫存編號:
- 185-5344
- Distrelec 貨號:
- 304-59-551
- 製造零件編號:
- 2309409-1
- 製造商:
- TE Connectivity
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | TE Connectivity | |
| Product Type | DIMM Socket | |
| Memory Socket Type | DIMM | |
| Orientation | Right Angle | |
| Insertion/Removal Method | Cam-In | |
| Contact Material | Copper Alloy | |
| Current | 500mA | |
| Contact Plating | Gold Flash, Nickel Plated | |
| Number of Contacts | 260 | |
| Pitch | 0.5mm | |
| Mount Type | Surface Mount | |
| Housing Material | Thermoplastic | |
| SDRAM Type | SO | |
| Latching | Yes | |
| Minimum Operating Temperature | 85°C | |
| Termination Type | Solder | |
| Row Spacing | 8.2mm | |
| Maximum Operating Temperature | 85°C | |
| Maximum Contact Resistance | 50mΩ | |
| Standards/Approvals | RoHS | |
| Series | 2309409 | |
| Voltage | 25.0 V | |
| 選取全部 | ||
|---|---|---|
品牌 TE Connectivity | ||
Product Type DIMM Socket | ||
Memory Socket Type DIMM | ||
Orientation Right Angle | ||
Insertion/Removal Method Cam-In | ||
Contact Material Copper Alloy | ||
Current 500mA | ||
Contact Plating Gold Flash, Nickel Plated | ||
Number of Contacts 260 | ||
Pitch 0.5mm | ||
Mount Type Surface Mount | ||
Housing Material Thermoplastic | ||
SDRAM Type SO | ||
Latching Yes | ||
Minimum Operating Temperature 85°C | ||
Termination Type Solder | ||
Row Spacing 8.2mm | ||
Maximum Operating Temperature 85°C | ||
Maximum Contact Resistance 50mΩ | ||
Standards/Approvals RoHS | ||
Series 2309409 | ||
Voltage 25.0 V | ||
TE Connectivity’s (TE) main memory connectors are made to JEDEC industry standards for dual in-line memory modules (DIMM) and small outline DIMM (SO DIMM) as well as custom memory modules for server, workstation, desktop, notebook, storage and communication applications. Our memory socket portfolio covers the DDR2, DDR3, and DDR4 generations of sockets. Each product family consists of vertical and a few right-angle and various-angled configurations in solder tail and surface mount (SMT) mounting options.
Designed to JEDEC industry standards for new and existing DIMM memory modules
Provide end latches for module retention, ejection and mechanical voltage keying
SO DIMM sockets are offered in several stacking heights to maximize board space
Applications
Servers
High Performance Computing (HPC)
Workstations
Mass storages
Communication equipment
Desktop PCs
Instrument equipment
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