TE Connectivity 0.5 mm Pitch 260 Way, Right Angle Surface Mount Mount SO DIMM Socket ,25.0 V, 500mA
- RS庫存編號:
- 185-5879
- 製造零件編號:
- 2309409-1
- 製造商:
- TE Connectivity
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- RS庫存編號:
- 185-5879
- 製造零件編號:
- 2309409-1
- 製造商:
- TE Connectivity
規格
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產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | TE Connectivity | |
| Product Type | DIMM Socket | |
| Memory Socket Type | DIMM | |
| Insertion/Removal Method | Cam-In | |
| Orientation | Right Angle | |
| Current | 500mA | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold Flash, Nickel Plated | |
| Number of Contacts | 260 | |
| Pitch | 0.5mm | |
| Mount Type | Surface Mount | |
| Housing Material | Thermoplastic | |
| SDRAM Type | SO | |
| Termination Type | Solder | |
| Latching | Yes | |
| Minimum Operating Temperature | 85°C | |
| Maximum Operating Temperature | 85°C | |
| Row Spacing | 8.2mm | |
| Standards/Approvals | RoHS | |
| Maximum Contact Resistance | 50mΩ | |
| Series | 2309409 | |
| Voltage | 25.0 V | |
| 選取全部 | ||
|---|---|---|
品牌 TE Connectivity | ||
Product Type DIMM Socket | ||
Memory Socket Type DIMM | ||
Insertion/Removal Method Cam-In | ||
Orientation Right Angle | ||
Current 500mA | ||
Contact Material Copper Alloy | ||
Contact Plating Gold Flash, Nickel Plated | ||
Number of Contacts 260 | ||
Pitch 0.5mm | ||
Mount Type Surface Mount | ||
Housing Material Thermoplastic | ||
SDRAM Type SO | ||
Termination Type Solder | ||
Latching Yes | ||
Minimum Operating Temperature 85°C | ||
Maximum Operating Temperature 85°C | ||
Row Spacing 8.2mm | ||
Standards/Approvals RoHS | ||
Maximum Contact Resistance 50mΩ | ||
Series 2309409 | ||
Voltage 25.0 V | ||
TE Connectivity’s (TE) main memory connectors are made to JEDEC industry standards for dual in-line memory modules (DIMM) and small outline DIMM (SO DIMM) as well as custom memory modules for server, workstation, desktop, notebook, storage and communication applications. Our memory socket portfolio covers the DDR2, DDR3, and DDR4 generations of sockets. Each product family consists of vertical and a few right-angle and various-angled configurations in solder tail and surface mount (SMT) mounting options.
Designed to JEDEC industry standards for new and existing DIMM memory modules
Provide end latches for module retention, ejection and mechanical voltage keying
SO DIMM sockets are offered in several stacking heights to maximize board space
Applications
Servers
High Performance Computing (HPC)
Workstations
Mass storages
Communication equipment
Desktop PCs
Instrument equipment
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