Infineon, Type N-Channel Common Emitter IGBT, 100 A 1200 V, 31-Pin Module, Panel
- RS庫存編號:
- 273-2920
- 製造零件編號:
- FP100R12N2T7BPSA2
- 製造商:
- Infineon
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TWD3,165.00
(不含稅)
TWD3,323.25
(含稅)
訂單超過 $1,300.00 免費送貨
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單位 | 每單位 |
|---|---|
| 1 - 4 | TWD3,165.00 |
| 5 - 9 | TWD3,102.00 |
| 10 - 24 | TWD3,040.00 |
| 25 - 49 | TWD2,979.00 |
| 50 + | TWD2,919.00 |
* 參考價格
- RS庫存編號:
- 273-2920
- 製造零件編號:
- FP100R12N2T7BPSA2
- 製造商:
- Infineon
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Infineon | |
| Maximum Continuous Collector Current Ic | 100A | |
| Product Type | IGBT | |
| Maximum Collector Emitter Voltage Vceo | 1200V | |
| Maximum Power Dissipation Pd | 20mW | |
| Number of Transistors | 7 | |
| Package Type | Module | |
| Configuration | Common Emitter | |
| Mount Type | Panel | |
| Channel Type | Type N | |
| Pin Count | 31 | |
| Minimum Operating Temperature | -40°C | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Maximum Collector Emitter Saturation Voltage VceSAT | 1.72V | |
| Maximum Operating Temperature | 175°C | |
| Height | 20.5mm | |
| Standards/Approvals | IEC 60749, IEC 60747, IEC 60068 | |
| Length | 122mm | |
| Automotive Standard | No | |
| 選取全部 | ||
|---|---|---|
品牌 Infineon | ||
Maximum Continuous Collector Current Ic 100A | ||
Product Type IGBT | ||
Maximum Collector Emitter Voltage Vceo 1200V | ||
Maximum Power Dissipation Pd 20mW | ||
Number of Transistors 7 | ||
Package Type Module | ||
Configuration Common Emitter | ||
Mount Type Panel | ||
Channel Type Type N | ||
Pin Count 31 | ||
Minimum Operating Temperature -40°C | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Maximum Collector Emitter Saturation Voltage VceSAT 1.72V | ||
Maximum Operating Temperature 175°C | ||
Height 20.5mm | ||
Standards/Approvals IEC 60749, IEC 60747, IEC 60068 | ||
Length 122mm | ||
Automotive Standard No | ||
The Infineon three phase PIM IGBT module with TRENCHSTOP IGBT7, emitter controlled 7 diode and NTC. The PIM (Power Integrated Modules) with integration of rectifier and brake chopper enables system cost savings.
High reliability and power density
Copper base plate for optimized heat spread
High power density
Solder contact technology
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