Infineon, Type N-Channel Inverter, 1800 A 1700 V, 10-Pin PRIME3, Surface
- RS庫存編號:
- 218-4332
- 製造零件編號:
- FF1800R17IP5PBPSA1
- 製造商:
- Infineon
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可享批量折扣
查看批量定價選項小計（1 托盤，共 3 件）*
TWD110,685.00
(不含稅)
TWD116,219.25
(含稅)
庫存資訊目前無法存取 - 請稍後再回來查看
單位 | 每單位 | 每托盤* |
|---|---|---|
| 3 - 3 | TWD36,895.00 | TWD110,685.00 |
| 6 + | TWD35,788.00 | TWD107,364.00 |
* 參考價格
- RS庫存編號:
- 218-4332
- 製造零件編號:
- FF1800R17IP5PBPSA1
- 製造商:
- Infineon
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Infineon | |
| Maximum Continuous Collector Current Ic | 1800A | |
| Product Type | Inverter | |
| Maximum Collector Emitter Voltage Vceo | 1700V | |
| Maximum Power Dissipation Pd | 1800kW | |
| Number of Transistors | 2 | |
| Package Type | PRIME3 | |
| Mount Type | Surface | |
| Channel Type | Type N | |
| Pin Count | 10 | |
| Maximum Collector Emitter Saturation Voltage VceSAT | 2.9V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Maximum Operating Temperature | 175°C | |
| Length | 247mm | |
| Standards/Approvals | No | |
| Height | 38.25mm | |
| Series | FF1800R17IP5P | |
| Automotive Standard | No | |
| 選取全部 | ||
|---|---|---|
品牌 Infineon | ||
Maximum Continuous Collector Current Ic 1800A | ||
Product Type Inverter | ||
Maximum Collector Emitter Voltage Vceo 1700V | ||
Maximum Power Dissipation Pd 1800kW | ||
Number of Transistors 2 | ||
Package Type PRIME3 | ||
Mount Type Surface | ||
Channel Type Type N | ||
Pin Count 10 | ||
Maximum Collector Emitter Saturation Voltage VceSAT 2.9V | ||
Minimum Operating Temperature -40°C | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Maximum Operating Temperature 175°C | ||
Length 247mm | ||
Standards/Approvals No | ||
Height 38.25mm | ||
Series FF1800R17IP5P | ||
Automotive Standard No | ||
The Infineon PrimePack dual IGBT module with TRENCHSTOP IGBT5 and .XT interconnection technology. It has collector emitter voltage of 1700 V. The N-Channel TRENCHSTOP and field stop IGBT Modules are suitable for hard switching and soft switching applications such as high power converters, UPS system, motor drives and solar applications.
Copper bonds for high current carrying capabilities
Sintering of chips for highest power cycling capabilities
Total losses reduced by up to 20%
Less cooling effort for same output power
Enables higher system overload conditions
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