Infineon, N-Channel IGBT Single Transistor IC, 40 A 1350 V, 3-Pin TO-247, Through Hole

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RS庫存編號:
215-6635
製造零件編號:
IHW20N135R5XKSA1
製造商:
Infineon
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品牌

Infineon

Maximum Continuous Collector Current Ic

40A

Product Type

IGBT Single Transistor IC

Maximum Collector Emitter Voltage Vceo

1350V

Maximum Power Dissipation Pd

310W

Package Type

TO-247

Mount Type

Through Hole

Channel Type

N

Pin Count

3

Maximum Collector Emitter Saturation Voltage VceSAT

1.85V

Maximum Gate Emitter Voltage VGEO

±25 V

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

175°C

Width

16.13mm

Series

Resonant Switching

Length

42mm

Standards/Approvals

IEC61249-2-21, RoHS

Height

5.21mm

Automotive Standard

No

Infineon Resonant Switching Series IGBT Single Transistor IC, 1350V Max Collector Emitter Voltage, 40A Max Continuous Collector Current - IHW20N135R5XKSA1


This IGBT single-transistor IC is a high-voltage switching device designed for power-conversion environments where robust collector-emitter performance is required. It operates across an extended temperature span suitable for demanding thermal conditions and is supplied in a through-hole TO-247 package for conventional board mounting. The device targets resonant switching applications requiring substantial continuous current handling and low saturation during conduction.

Features and Benefits:


• 1350V collector-emitter rating enables high-voltage operation
• 40A continuous collector current supports heavy load currents
• 1.85V VCE(sat) reduces conduction losses under load
• ±25V gate-emitter tolerance allows wide drive voltages
• 310W power dissipation permits high-power switching
• -40 to 175 °C operational range sustains extreme temperatures

Applications


• Suitable for resonant converters in power supplies
• Ideal for industrial motor drive inverter stages
• Used with high-voltage switch-mode power supplies
• Can be used for utility-grade power conversion modules
• Suitable for high-power DC-DC converter topologies

What mounting approach does this device require?


It is supplied in a TO-247 through-hole package intended for soldered board mounting and heat-sinking through the package tab.

How does the transistor manage heat in continuous operation?


The maximum power dissipation rating of 310W defines the thermal load it can handle when fitted to an appropriate thermal path such as a heat sink and correct airflow.

What gate-drive constraints must be observed?


The gate-emitter voltage must be kept within ±25V to avoid gate insulation stress and ensure reliable switching.

Are there material or regulatory restrictions relevant to design?


The device conforms to RoHS requirements and is manufactured using materials meeting IEC 61249-2-21 standards for certain substrate compositions.

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