Infineon FS200R12KT4RBOSA1, Type N-Channel IGBT Module, 280 A 1200 V, 35-Pin EconoPACK 3, Clamp

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  • 2028年7月10日 發貨
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包裝方式:
RS庫存編號:
110-7155
製造零件編號:
FS200R12KT4RBOSA1
製造商:
Infineon
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品牌

Infineon

Product Type

IGBT Module

Maximum Continuous Collector Current Ic

280A

Maximum Collector Emitter Voltage Vceo

1200V

Maximum Power Dissipation Pd

1kW

Package Type

EconoPACK 3

Mount Type

Clamp

Channel Type

Type N

Pin Count

35

Maximum Collector Emitter Saturation Voltage VceSAT

2.15V

Maximum Gate Emitter Voltage VGEO

20 V

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

150°C

Standards/Approvals

No

Length

122mm

Height

17mm

Automotive Standard

No

不適用

Infineon IGBT Module, 1200V Max Collector Emitter Voltage, 280A Max Continuous Collector Current - FS200R12KT4RBOSA1


This IGBT module is a high-power semiconductor assembly designed to control and switch large DC currents in industrial power converters. It supports heavy-duty operation across a wide temperature range and is packaged for straightforward mounting in commercial power systems. The device offers a high collector-emitter voltage rating and substantial continuous current capability suited to demanding switching applications.

Features and Benefits:


• 1200V collector-emitter rating enabling high-voltage switching
• 280A continuous collector current for sustained high-load operation
• 2.15V low VCE(sat) reducing conduction losses during on-state
• 1kW maximum power dissipation for elevated power handling
• 20V gate-emitter rating allowing robust gate drive margins
• 35-pin Type N configuration for multiple control and sensing connections

Applications


• Suitable for industrial motor drives requiring high-voltage switching
• Ideal for inverter stages in renewable-energy converters
• Used with traction and heavy-equipment inverters in harsh environments
• Can be used for power supplies and UPS systems with high current needs
• Suitable for laboratory and test rigs validating high-power switching designs

What mounting method does it require for chassis integration?


It uses a clamp-mounting system that secures the package to heat-sinking surfaces for thermal contact and mechanical stability.

How compact is this module for dense power assemblies?


The package footprint measures 122x62mm, providing a compact form factor for tight layouts while supporting high-power operation.

What environmental temperatures can it tolerate during operation?


It is specified to operate reliably from -40 °C up to 150 °C, permitting use in both cold-start and high-temperature conditions.

What package style is used for thermal and electrical layout consistency?


The module is presented in an EconoPACK 3 package to standardise mounting and thermal-interface considerations.

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