Fischer Elektronik Heatsink, Universal Rectangular Alu with Fan 83 mm 150 mm 80 mm
- RS庫存編號:
- 692-0626
- 製造零件編號:
- LA 9 150 24 V
- 製造商:
- Fischer Elektronik
此圖片僅供參考，請參閲產品詳細資訊及規格
小計（1 件）*
TWD7,127.00
(不含稅)
TWD7,483.35
(含稅)
添加 1 件 件可免費送貨
- 6 件準備從其他地點送貨
- 加上 3 件從 2026年3月09日 起發貨
- 加上 6 件從 2026年5月11日 起發貨
單位 | 每單位 |
|---|---|
| 1 - 99 | TWD7,127.00 |
| 100 - 249 | TWD6,842.00 |
| 250 - 499 | TWD6,739.00 |
| 500 + | TWD6,672.00 |
* 參考價格
- RS庫存編號:
- 692-0626
- 製造零件編號:
- LA 9 150 24 V
- 製造商:
- Fischer Elektronik
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Fischer Elektronik | |
| Product Type | Heatsink | |
| For Use With | Universal Rectangular Alu with Fan | |
| Length | 150mm | |
| Width | 80 mm | |
| Height | 83mm | |
| Finish | Black Anodised | |
| Standards/Approvals | No | |
| Application | Cooling | |
| Material | Aluminium | |
| Special Features | Technical Introduction, Maximum Heat Flow Due to Brazing or Thermal Adhesion, Two Opposite Mounting Surfaces Are Milled Flat, Geometry of Hollow Fin Optimizing the Air Flow, Cooling Aggreg in Segment Mount, Additional Treatment Upon Customer's Request, Particularly Effective Heat Dissipation, High Performance Density Due to Large Heatconducting Surfaces, Standard Aluminium Profiles, Special Heatsink Design, Miniature Cooling Aggregates, Compact Construction, Mounting Pads, Protection Grid for Axial Fans, With Air Flow Chamber, Silicone Wafers, Extremely Low Losses Due to Optimised Hollow Fin Geometry, Thermal Conductive Silicone Foam Foil, Heatsinks With Hollow Fin Profile, Cooling Aggregates With Radial Fan, High Performance Cooling Aggregates, Semiconductor Mounting Surface for Milled Flat, Heatsinks for Solid State Relay, Hole Pattern, Cooling Aggregates With Axial Fan | |
| 選取全部 | ||
|---|---|---|
品牌 Fischer Elektronik | ||
Product Type Heatsink | ||
For Use With Universal Rectangular Alu with Fan | ||
Length 150mm | ||
Width 80 mm | ||
Height 83mm | ||
Finish Black Anodised | ||
Standards/Approvals No | ||
Application Cooling | ||
Material Aluminium | ||
Special Features Technical Introduction, Maximum Heat Flow Due to Brazing or Thermal Adhesion, Two Opposite Mounting Surfaces Are Milled Flat, Geometry of Hollow Fin Optimizing the Air Flow, Cooling Aggreg in Segment Mount, Additional Treatment Upon Customer's Request, Particularly Effective Heat Dissipation, High Performance Density Due to Large Heatconducting Surfaces, Standard Aluminium Profiles, Special Heatsink Design, Miniature Cooling Aggregates, Compact Construction, Mounting Pads, Protection Grid for Axial Fans, With Air Flow Chamber, Silicone Wafers, Extremely Low Losses Due to Optimised Hollow Fin Geometry, Thermal Conductive Silicone Foam Foil, Heatsinks With Hollow Fin Profile, Cooling Aggregates With Radial Fan, High Performance Cooling Aggregates, Semiconductor Mounting Surface for Milled Flat, Heatsinks for Solid State Relay, Hole Pattern, Cooling Aggregates With Axial Fan | ||
- COO (Country of Origin):
- HU
Fischer Elektronik Cooling Aggregates with Axial Fans
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