Fischer Elektronik Heatsink, Universal Square Alu 6.5 mm 10 mm 10 mm
- RS庫存編號:
- 674-4784
- 製造零件編號:
- ICK S 10x10x6,5
- 製造商:
- Fischer Elektronik
小計（1 件）*
TWD169.00
(不含稅)
TWD177.45
(含稅)
訂單超過 $1,300.00 免費送貨
- 加上 24 件從 2026年2月23日 起發貨
單位 | 每單位 |
|---|---|
| 1 - 49 | TWD169.00 |
| 50 - 99 | TWD164.00 |
| 100 - 249 | TWD159.00 |
| 250 + | TWD158.00 |
* 參考價格
- RS庫存編號:
- 674-4784
- 製造零件編號:
- ICK S 10x10x6,5
- 製造商:
- Fischer Elektronik
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Fischer Elektronik | |
| For Use With | Universal Square Alu | |
| Product Type | Heatsink | |
| Length | 10mm | |
| Width | 10 mm | |
| Height | 6.5mm | |
| Fastening | Conductive Foil | |
| Finish | Black Anodised | |
| Compatible Package Type | PLCC, IC, SMD, BGA, DIL/IC, PGA | |
| Standards/Approvals | No | |
| Material | Aluminium | |
| Application | Power PC, Heat Sink For IC, Cooler, Bga, SMD, PLCC, Microprocessor, PGA, Fan, Ic Processors | |
| Special Features | Low Weight by Optimised Geometry, Effective Heat Dissipation by Optimum Fan Motor and Heatsink Design, Constant Heat Distribution in Base and Pins in Direction of Heat Flow, Low Current Consumption and Low Self-Heating, Other Operating Voltages on Request, Other Pin Lengths and Surfaces on Request, Adhesive Foil or Clamps, Double Ball Bearings for High Reliability and Long Product Life, Particularly Suited for Ball Grid Arrays, Components Fastened Using Glue, Excellent Thermal Efficiency by Flow-Favourable Omnidirectional Fin Geometry, Customer-specific Modifications and Special Designs, High-grade Industrial Type, Compact Design With High Mechanical Stability, Heat Sink Dimensions Match Respective BGA Type, Available With Pulse Output and Alarm Device Circuit, Can Be Glued Directly on BGA Component | |
| 選取全部 | ||
|---|---|---|
品牌 Fischer Elektronik | ||
For Use With Universal Square Alu | ||
Product Type Heatsink | ||
Length 10mm | ||
Width 10 mm | ||
Height 6.5mm | ||
Fastening Conductive Foil | ||
Finish Black Anodised | ||
Compatible Package Type PLCC, IC, SMD, BGA, DIL/IC, PGA | ||
Standards/Approvals No | ||
Material Aluminium | ||
Application Power PC, Heat Sink For IC, Cooler, Bga, SMD, PLCC, Microprocessor, PGA, Fan, Ic Processors | ||
Special Features Low Weight by Optimised Geometry, Effective Heat Dissipation by Optimum Fan Motor and Heatsink Design, Constant Heat Distribution in Base and Pins in Direction of Heat Flow, Low Current Consumption and Low Self-Heating, Other Operating Voltages on Request, Other Pin Lengths and Surfaces on Request, Adhesive Foil or Clamps, Double Ball Bearings for High Reliability and Long Product Life, Particularly Suited for Ball Grid Arrays, Components Fastened Using Glue, Excellent Thermal Efficiency by Flow-Favourable Omnidirectional Fin Geometry, Customer-specific Modifications and Special Designs, High-grade Industrial Type, Compact Design With High Mechanical Stability, Heat Sink Dimensions Match Respective BGA Type, Available With Pulse Output and Alarm Device Circuit, Can Be Glued Directly on BGA Component | ||
- COO (Country of Origin):
- DE
ICK S Series
PGA Heatsinks
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