Fischer Elektronik Heatsink, Universal Round Alu, 5.6°C/W 20 mm
- RS庫存編號:
- 674-4844
- 製造零件編號:
- ICK S R 32,5x20
- 製造商:
- Fischer Elektronik
小計（1 件）*
TWD417.00
(不含稅)
TWD437.85
(含稅)
添加 4 件 件可免費送貨
- 加上 60 件從 2026年2月23日 起發貨
單位 | 每單位 |
|---|---|
| 1 - 49 | TWD417.00 |
| 50 - 99 | TWD411.00 |
| 100 - 249 | TWD403.00 |
| 250 + | TWD393.00 |
* 參考價格
- RS庫存編號:
- 674-4844
- 製造零件編號:
- ICK S R 32,5x20
- 製造商:
- Fischer Elektronik
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Fischer Elektronik | |
| Product Type | Heatsink | |
| For Use With | Universal Round Alu | |
| Height | 20mm | |
| Fastening | Conductive Foil | |
| Thermal Resistance | 5.6°C/W | |
| Diameter | 32.5 mm | |
| Finish | Black Anodised | |
| Compatible Package Type | LED, PGA, PLCC, BGA, SMD, IC, DIL/IC, Chip, Slot | |
| Standards/Approvals | No | |
| Material | Aluminium | |
| Application | PLCC, Power PC, PGA, Bga, Microprocessor, Fan, Heat Sink For IC, Cooler, Ic Processors, SMD | |
| Special Features | Compact Design With High Mechanical Stability, Customer Specific Modifications and Special Designs, Excellent Thermal Efficiency, Other Operating Voltages on Request, High Mechanical Stability, Effective Heat Dissipation, Fan Motors With Pulse Output and Alarm Device Circuit, Flow-favourable Omnidirectional Fin Geometry, Other Pin Lengths and Surfaces on Request, Components Fastened Using Glue Adhesive Foil or Clamps, High-grade Industrial Type, Particularly Suited for Ball Grid Arrays, Low Current Consumption, Can Be Glued Directly on BGA Component, Low Weight by Optimised Geometry, Heat Sink Dimensions Match Respective BGA Type, Fan Motor Axle With Double Ball Bearings | |
| 選取全部 | ||
|---|---|---|
品牌 Fischer Elektronik | ||
Product Type Heatsink | ||
For Use With Universal Round Alu | ||
Height 20mm | ||
Fastening Conductive Foil | ||
Thermal Resistance 5.6°C/W | ||
Diameter 32.5 mm | ||
Finish Black Anodised | ||
Compatible Package Type LED, PGA, PLCC, BGA, SMD, IC, DIL/IC, Chip, Slot | ||
Standards/Approvals No | ||
Material Aluminium | ||
Application PLCC, Power PC, PGA, Bga, Microprocessor, Fan, Heat Sink For IC, Cooler, Ic Processors, SMD | ||
Special Features Compact Design With High Mechanical Stability, Customer Specific Modifications and Special Designs, Excellent Thermal Efficiency, Other Operating Voltages on Request, High Mechanical Stability, Effective Heat Dissipation, Fan Motors With Pulse Output and Alarm Device Circuit, Flow-favourable Omnidirectional Fin Geometry, Other Pin Lengths and Surfaces on Request, Components Fastened Using Glue Adhesive Foil or Clamps, High-grade Industrial Type, Particularly Suited for Ball Grid Arrays, Low Current Consumption, Can Be Glued Directly on BGA Component, Low Weight by Optimised Geometry, Heat Sink Dimensions Match Respective BGA Type, Fan Motor Axle With Double Ball Bearings | ||
- COO (Country of Origin):
- DE
ICK S R Series
PGA Heatsinks
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