Fischer Elektronik Heatsink, Universal Square Alu 10 mm 40 mm 40 mm
- RS庫存編號:
- 674-4769
- 製造零件編號:
- ICK BGA 40x40x10
- 製造商:
- Fischer Elektronik
可享批量折扣
小計（1 件）*
TWD160.00
(不含稅)
TWD168.00
(含稅)
添加 9 件 件可免費送貨
有限的庫存
- 57 件準備從其他地點送貨
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單位 | 每單位 |
|---|---|
| 1 - 49 | TWD160.00 |
| 50 - 99 | TWD151.00 |
| 100 - 249 | TWD148.00 |
| 250 + | TWD143.00 |
* 參考價格
- RS庫存編號:
- 674-4769
- 製造零件編號:
- ICK BGA 40x40x10
- 製造商:
- Fischer Elektronik
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Fischer Elektronik | |
| For Use With | Universal Square Alu | |
| Product Type | Heatsink | |
| Length | 40mm | |
| Width | 40 mm | |
| Height | 10mm | |
| Fastening | Conductive Foil | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | PGA, IC, LED, SMD, PLCC, DIL/IC, BGA | |
| Standards/Approvals | No | |
| Material | Aluminium | |
| Application | Power PC, Cooler, PLCC, Semiconductor, Ic Processors, Fan, Thermal, Microprocessor, SMD, Pin Heat Sinks, PGA, Heat Sink For IC, Bga | |
| Special Features | Effective Heat Dissipation, Pulse Output and Alarm Device Circuit, High-grade Industrial Type, High Mechanical Stability, Flow-favourable Omnidirectional Fin Geometry, High Reliability, Low Current Consumption, Easy Mounting, Compact Design, Excellent Thermal Efficiency | |
| 選取全部 | ||
|---|---|---|
品牌 Fischer Elektronik | ||
For Use With Universal Square Alu | ||
Product Type Heatsink | ||
Length 40mm | ||
Width 40 mm | ||
Height 10mm | ||
Fastening Conductive Foil | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type PGA, IC, LED, SMD, PLCC, DIL/IC, BGA | ||
Standards/Approvals No | ||
Material Aluminium | ||
Application Power PC, Cooler, PLCC, Semiconductor, Ic Processors, Fan, Thermal, Microprocessor, SMD, Pin Heat Sinks, PGA, Heat Sink For IC, Bga | ||
Special Features Effective Heat Dissipation, Pulse Output and Alarm Device Circuit, High-grade Industrial Type, High Mechanical Stability, Flow-favourable Omnidirectional Fin Geometry, High Reliability, Low Current Consumption, Easy Mounting, Compact Design, Excellent Thermal Efficiency | ||
- COO (Country of Origin):
- DE
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks
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