Fischer Elektronik Heatsink, Universal Square Alu 10 mm 35 mm 35mm
- RS庫存編號:
- 674-4765
- 製造零件編號:
- ICK BGA 35x35x10
- 製造商:
- Fischer Elektronik
可享批量折扣
小計（1 件）*
TWD83.00
(不含稅)
TWD87.15
(含稅)
訂單超過 $1,300.00 免費送貨
有庫存
- 加上 234 件從 2026年5月25日 起發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 |
|---|---|
| 1 - 49 | TWD83.00 |
| 50 - 99 | TWD82.00 |
| 100 - 249 | TWD78.00 |
| 250 + | TWD76.00 |
* 參考價格
- RS庫存編號:
- 674-4765
- 製造零件編號:
- ICK BGA 35x35x10
- 製造商:
- Fischer Elektronik
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Fischer Elektronik | |
| For Use With | Universal Square Alu | |
| Product Type | Heatsink | |
| Length | 35mm | |
| Width | 35mm | |
| Height | 10mm | |
| Fastening | Clamp, Glue, Integrated clamp, Screw, Thermally conductive adhesive | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | BGA | |
| Standards/Approvals | No | |
| Application | Heat Sink For Power PC, Semiconductor, Technical Introduction, Heatsink for PGA, SMD, Fan, Hole Pattern, Thermal, Heat Sink For 3 II Mobile Module, Heat Sink For IC, Cooler, Heat Sink For Microprocessor, Heat Sink For Bga, Pin Heat Sinks, Heat Sink For Dil/Ic, Processor Overview, Heat Sink For PLCC | |
| Material | Aluminium | |
| 選取全部 | ||
|---|---|---|
品牌 Fischer Elektronik | ||
For Use With Universal Square Alu | ||
Product Type Heatsink | ||
Length 35mm | ||
Width 35mm | ||
Height 10mm | ||
Fastening Clamp, Glue, Integrated clamp, Screw, Thermally conductive adhesive | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type BGA | ||
Standards/Approvals No | ||
Application Heat Sink For Power PC, Semiconductor, Technical Introduction, Heatsink for PGA, SMD, Fan, Hole Pattern, Thermal, Heat Sink For 3 II Mobile Module, Heat Sink For IC, Cooler, Heat Sink For Microprocessor, Heat Sink For Bga, Pin Heat Sinks, Heat Sink For Dil/Ic, Processor Overview, Heat Sink For PLCC | ||
Material Aluminium | ||
- COO (Country of Origin):
- DE
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks
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