SPREADFAST Heatsink, Universal Square Ceramic, 23.7°C/W, 40 °C/W 6 mm 30 mm 30 mm
- RS庫存編號:
- 123-5618
- 製造零件編號:
- SF-CHS-303006P
- 製造商:
- SPREADFAST
可享批量折扣
小計（1 包，共 5 件）*
TWD308.00
(不含稅)
TWD323.40
(含稅)
訂單超過 $1,300.00 免費送貨
有庫存
- 140 件準備從其他地點送貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每包* |
|---|---|---|
| 5 - 120 | TWD61.60 | TWD308.00 |
| 125 - 245 | TWD59.20 | TWD296.00 |
| 250 - 495 | TWD56.40 | TWD282.00 |
| 500 + | TWD55.00 | TWD275.00 |
* 參考價格
- RS庫存編號:
- 123-5618
- 製造零件編號:
- SF-CHS-303006P
- 製造商:
- SPREADFAST
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | SPREADFAST | |
| Product Type | Heatsink | |
| For Use With | Universal Square Ceramic | |
| Length | 30mm | |
| Width | 30 mm | |
| Height | 6mm | |
| Fastening | Adhesive, Screw | |
| Thermal Resistance | 23.7, 40°C/W | |
| Series | Pin Fin | |
| Colour | White | |
| Standards/Approvals | RoHS | |
| Material | Aluminium Oxide | |
| Special Features | Ideal for Direct Metalisation, High Breakdown Voltage, Good Thermal Cycling Stability, Lower density, Good EMC, Good Heat Spreader, High Volume Resistivity | |
| 選取全部 | ||
|---|---|---|
品牌 SPREADFAST | ||
Product Type Heatsink | ||
For Use With Universal Square Ceramic | ||
Length 30mm | ||
Width 30 mm | ||
Height 6mm | ||
Fastening Adhesive, Screw | ||
Thermal Resistance 23.7, 40°C/W | ||
Series Pin Fin | ||
Colour White | ||
Standards/Approvals RoHS | ||
Material Aluminium Oxide | ||
Special Features Ideal for Direct Metalisation, High Breakdown Voltage, Good Thermal Cycling Stability, Lower density, Good EMC, Good Heat Spreader, High Volume Resistivity | ||
- COO (Country of Origin):
- CN
Spreadfast SF-CHS Series Square Pin Ceramic Heatsink
Spreadfast SF-CHS series of square pin ceramic heatsinks have been designed as a lower density improvement over traditional metal heatsinks. The innate characteristics of ceramic heatsinks means the SF-CHS series have a high breakdown voltage and heat dissipation. Thanks to the meticulous design of these ceramic heatsinks, the SF-CHS series are ideally suited to applications where thermal cycling stability are required.
Typical Applications
Traditional heatsink replacement.
LED & chipset cooling.
Power modules.
IC cooling.
Ceramic Heatsinks
相關連結
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