SPREADFAST Heatsink, Universal Square Ceramic, 52.5°C/W 6 mm 15 mm 15 mm
- RS庫存編號:
- 123-5629
- 製造零件編號:
- SF-CHS-151506-PC
- 製造商:
- SPREADFAST
可享批量折扣
小計（1 包，共 5 件）*
TWD143.00
(不含稅)
TWD150.15
(含稅)
訂單超過 $1,300.00 免費送貨
有庫存
- 480 件準備從其他地點送貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每包* |
|---|---|---|
| 5 - 120 | TWD28.60 | TWD143.00 |
| 125 - 245 | TWD27.20 | TWD136.00 |
| 250 - 495 | TWD26.20 | TWD131.00 |
| 500 + | TWD25.80 | TWD129.00 |
* 參考價格
- RS庫存編號:
- 123-5629
- 製造零件編號:
- SF-CHS-151506-PC
- 製造商:
- SPREADFAST
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | SPREADFAST | |
| Product Type | Heatsink | |
| For Use With | Universal Square Ceramic | |
| Length | 15mm | |
| Width | 15 mm | |
| Height | 6mm | |
| Thermal Resistance | 52.5°C/W | |
| Fastening | Screw, Adhesive | |
| Series | Pin Fin | |
| Colour | White | |
| Finish | White | |
| Standards/Approvals | RoHS | |
| Material | Ceramic | |
| Special Features | Lower density, Good Thermal Cycling Stability, Ideal for Direct Metalisation, High Volume Resistivity, High Breakdown Voltage, Good Heat Spreader, Good EMC | |
| 選取全部 | ||
|---|---|---|
品牌 SPREADFAST | ||
Product Type Heatsink | ||
For Use With Universal Square Ceramic | ||
Length 15mm | ||
Width 15 mm | ||
Height 6mm | ||
Thermal Resistance 52.5°C/W | ||
Fastening Screw, Adhesive | ||
Series Pin Fin | ||
Colour White | ||
Finish White | ||
Standards/Approvals RoHS | ||
Material Ceramic | ||
Special Features Lower density, Good Thermal Cycling Stability, Ideal for Direct Metalisation, High Volume Resistivity, High Breakdown Voltage, Good Heat Spreader, Good EMC | ||
- COO (Country of Origin):
- CN
Spreadfast SF-CHS Series Round Pin Ceramic Heatsink
Spreadfast SF-CHS series of round pin ceramic heatsinks have been designed as a lower density improvement over traditional metal heatsinks. The innate characteristics of ceramic heatsinks means the SF-CHS series have a high breakdown voltage and heat dissipation. Thanks to the meticulous design of these ceramic heatsinks, the SF-CHS series are ideally suited to applications where thermal cycling stability are required.
Typical Applications
Traditional heatsink replacement.
LED & chipset cooling.
Power modules.
IC cooling.
Ceramic Heatsinks
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