STMicroelectronics HSP051-4M5 4-Element Uni-Directional TVS Diode, 5-Pin DFN
- RS庫存編號:
- 192-4287P
- 製造零件編號:
- HSP051-4M5
- 製造商:
- STMicroelectronics
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可享批量折扣
查看批量定價選項小計 1500 件 (以卷裝提供)*
TWD11,850.00
(不含稅)
TWD12,450.00
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2027年1月26日 發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 |
|---|---|
| 1500 - 2950 | TWD7.90 |
| 3000 + | TWD7.80 |
* 參考價格
- RS庫存編號:
- 192-4287P
- 製造零件編號:
- HSP051-4M5
- 製造商:
- STMicroelectronics
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | STMicroelectronics | |
| Direction Type | Uni-Directional | |
| Product Type | TVS Diode | |
| Diode Configuration | Array | |
| Minimum Breakdown Voltage Vbr | 5.7V | |
| Mount Type | Surface | |
| Package Type | DFN | |
| Maximum Reverse Stand-off Voltage Vwm | 5V | |
| Pin Count | 5 | |
| Clamping Voltage VC | 13.7V | |
| Maximum Peak Pulse Current Ippm | 3A | |
| Minimum Operating Temperature | -40°C | |
| ESD Protection | Yes | |
| Maximum Operating Temperature | 150°C | |
| Number of Elements per Chip | 4 | |
| Length | 1.4mm | |
| Height | 0.35mm | |
| Width | 0.9mm | |
| Standards/Approvals | No | |
| Automotive Standard | No | |
| Maximum Reverse Leakage Current | 70nA | |
| 選取全部 | ||
|---|---|---|
品牌 STMicroelectronics | ||
Direction Type Uni-Directional | ||
Product Type TVS Diode | ||
Diode Configuration Array | ||
Minimum Breakdown Voltage Vbr 5.7V | ||
Mount Type Surface | ||
Package Type DFN | ||
Maximum Reverse Stand-off Voltage Vwm 5V | ||
Pin Count 5 | ||
Clamping Voltage VC 13.7V | ||
Maximum Peak Pulse Current Ippm 3A | ||
Minimum Operating Temperature -40°C | ||
ESD Protection Yes | ||
Maximum Operating Temperature 150°C | ||
Number of Elements per Chip 4 | ||
Length 1.4mm | ||
Height 0.35mm | ||
Width 0.9mm | ||
Standards/Approvals No | ||
Automotive Standard No | ||
Maximum Reverse Leakage Current 70nA | ||
- COO (Country of Origin):
- CN
The HSP051-4M5 is a 4-channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines. The device is packaged in μQFN 1.3 mm x 0.8 mm with a 500 μm pitch.
Very compact 500 μm pitch package, for easy PCB layout
Very-large bandwidth: 11.5 GHz
Very-low capacitance: 0.2 pF (I/O to I/O) and 0.35 pF (I/O to GND)
Very low dynamic resistance : 0.35 Ω
Low leakage current: < 1 nA
High ESD protection level
High integration
Suitable for high density boards
Extended operating junction temperature range : -40 °C to 150 °C
±20 kV (contact discharge)
±30 kV (air discharge)
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