onsemi 2-Element Uni-Directional ESD Protection Diode, 6-Pin SC-88
- RS庫存編號:
- 171-8359
- 製造零件編號:
- SZESD1L001W1T2G
- 製造商:
- onsemi
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
小計（1 卷，共 3000 件）*
TWD25,200.00
(不含稅)
TWD26,460.00
(含稅)
庫存資訊目前無法存取 - 請稍後再回來查看
單位 | 每單位 | 每卷* |
|---|---|---|
| 3000 - 3000 | TWD8.40 | TWD25,200.00 |
| 6000 + | TWD8.30 | TWD24,900.00 |
* 參考價格
- RS庫存編號:
- 171-8359
- 製造零件編號:
- SZESD1L001W1T2G
- 製造商:
- onsemi
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | onsemi | |
| Direction Type | Uni-Directional | |
| Product Type | ESD Protection Diode | |
| Diode Configuration | Array | |
| Minimum Breakdown Voltage Vbr | 16.5V | |
| Mount Type | Surface | |
| Package Type | SC-88 | |
| Maximum Reverse Stand-off Voltage Vwm | 16V | |
| Pin Count | 6 | |
| ESD Protection | Yes | |
| Maximum Peak Pulse Current Ippm | 16A | |
| Test Current It | 1mA | |
| Clamping Voltage VC | 30V | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 125°C | |
| Number of Elements per Chip | 2 | |
| Length | 2.2mm | |
| Height | 1mm | |
| Standards/Approvals | No | |
| Automotive Standard | AEC-Q101 | |
| Maximum Reverse Leakage Current | 1μA | |
| 選取全部 | ||
|---|---|---|
品牌 onsemi | ||
Direction Type Uni-Directional | ||
Product Type ESD Protection Diode | ||
Diode Configuration Array | ||
Minimum Breakdown Voltage Vbr 16.5V | ||
Mount Type Surface | ||
Package Type SC-88 | ||
Maximum Reverse Stand-off Voltage Vwm 16V | ||
Pin Count 6 | ||
ESD Protection Yes | ||
Maximum Peak Pulse Current Ippm 16A | ||
Test Current It 1mA | ||
Clamping Voltage VC 30V | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 125°C | ||
Number of Elements per Chip 2 | ||
Length 2.2mm | ||
Height 1mm | ||
Standards/Approvals No | ||
Automotive Standard AEC-Q101 | ||
Maximum Reverse Leakage Current 1μA | ||
The ESD1L001 is designed to protect four high speed data lines from ESD. Ultra−low capacitance and low ESD clamping voltage make this device an ideal solution for protecting voltage sensitive high speed data lines. The small form factor, flow−through style package allows for easy PCB layout and matched trace lengths necessary to maintain consistent impedance between high speed differential lines such as USB 3.0 and HDMI.
Low Capacitance (0.3 pF Typical, I/O to GND)
Short to Battery Survivability
Low ESD Clamping Voltage (30 V Typical, +16 A TLP, I/O to GND)
SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements, PPAP Capable
These Devices are Pb−Free
USB2.0/3.0
LVDS
HDMI
High Speed Differential Pairs
10/100Mb Ethernet
Automotive Gateways
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