DiodesZetex DESD3V3S1BL-7B 1-Element Bi-Directional TVS Diode, 35 W, 2-Pin X1-DFN
- RS庫存編號:
- 718-551
- 製造零件編號:
- DESD3V3S1BL-7B
- 製造商:
- DiodesZetex
N
可享批量折扣
查看批量定價選項小計（1 包，共 5 件）*
TWD19.00
(不含稅)
TWD19.95
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 10,000 件從 2026年11月11日 起裝運發貨
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單位 | 每單位 | 每包* |
|---|---|---|
| 5 - 120 | TWD3.80 | TWD19.00 |
| 125 - 495 | TWD2.60 | TWD13.00 |
| 500 + | TWD1.40 | TWD7.00 |
* 參考價格
- RS庫存編號:
- 718-551
- 製造零件編號:
- DESD3V3S1BL-7B
- 製造商:
- DiodesZetex
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | DiodesZetex | |
| Direction Type | Bi-Directional | |
| Diode Configuration | Single Bi-Directional | |
| Product Type | TVS Diode | |
| Minimum Breakdown Voltage Vbr | 3.8V | |
| Mount Type | Surface | |
| Package Type | X1-DFN | |
| Pin Count | 2 | |
| Peak Pulse Power Dissipation Pppm | 35W | |
| ESD Protection | Yes | |
| Clamping Voltage VC | 7V | |
| Maximum Peak Pulse Current Ippm | 5A | |
| Minimum Operating Temperature | -65°C | |
| Maximum Operating Temperature | 150°C | |
| Number of Elements per Chip | 1 | |
| Height | 0.53mm | |
| Series | DESD3V3S1BL | |
| Width | 0.675mm | |
| Length | 1.075mm | |
| Automotive Standard | No | |
| 選取全部 | ||
|---|---|---|
品牌 DiodesZetex | ||
Direction Type Bi-Directional | ||
Diode Configuration Single Bi-Directional | ||
Product Type TVS Diode | ||
Minimum Breakdown Voltage Vbr 3.8V | ||
Mount Type Surface | ||
Package Type X1-DFN | ||
Pin Count 2 | ||
Peak Pulse Power Dissipation Pppm 35W | ||
ESD Protection Yes | ||
Clamping Voltage VC 7V | ||
Maximum Peak Pulse Current Ippm 5A | ||
Minimum Operating Temperature -65°C | ||
Maximum Operating Temperature 150°C | ||
Number of Elements per Chip 1 | ||
Height 0.53mm | ||
Series DESD3V3S1BL | ||
Width 0.675mm | ||
Length 1.075mm | ||
Automotive Standard No | ||
- COO (Country of Origin):
- CN
The DiodesZetex Low capacitance bidirectional transient voltage suppressor (TVS) effectively safeguards critical circuitry in portable electronics, communication systems, and various computing peripherals. Encased in an ultra-small X1-DFN1006-2 package, the device maintains a minimal footprint while offering high-performance protection against ESD events, thus ensuring reliable device operation in demanding environments. Its low-profile design caters to space-constrained applications, making it an Ideal choice for manufacturers aiming to enhance product longevity and user safety.
Low profile package with a maximum height of 0.53mm facilitates integration into Compact designs
Constructed from halogen and antimony-free materials, ensuring compliance with environmental regulations
NiPdAu over copper terminals offering excellent solderability and reliability in assembly
Offers low channel input capacitance, making it suitable for high-speed applications without signal distortion
Moisture sensitivity level 1, allowing for standard PCB assembly processes
Completely lead-free and RoHS compliant, reinforcing a commitment to sustainable production practices
Ideal for use in cellular handsets and various portable electronics, providing enhanced protection features
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