TE Connectivity NEOHM SMA-Q 174 kΩ, 0204 Thin Film Surface Mount Resistor 0.1 % Surface 0.4 W - SMA-Q0204BTCX174K

小計(1 卷,共 3000 件)*

TWD23,100.00

(不含稅)

TWD24,240.00

(含稅)

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3000 +TWD7.70TWD23,100.00

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RS庫存編號:
590-314
製造零件編號:
SMA-Q0204BTCX174K
製造商:
TE Connectivity
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品牌

TE Connectivity

Resistance

174kΩ

Product Type

Surface Mount Resistor

Resistor Type

Metal Film Precision

Technology

Thin Film

Package/Case

0204

Tolerance

0.1 %

Packaging

Tape & Reel

Power Rating

0.4W

Voltage

20V

Temperature Coefficient

±25 ppm/°C

Mount Type

Surface

Automotive Standard

AEC-Q200

Series

NEOHM SMA-Q

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

155°C

Standards/Approvals

Lead-Free, RoHS

Width

2.2mm

Length

3.5mm

COO (Country of Origin):
TW
The TE Connectivity Metal film precision MELF resistor represents a significant advancement in SMD technology tailored for high-performance applications. Designed with a robust construction and AEC-Q200 qualification, this resistor ensures reliability and allows for tight tolerances and low temperature coefficients for optimal precision. It is particularly well-suited for electronic devices in automotive, industrial, and telecommunications sectors, ensuring consistent performance even in the most demanding environments. The enhanced coating provides superior humidity protection, making it ideal for applications with significant moisture exposure. The It excels in delivering high power ratings and stability, making it an exceptional choice for reliable circuitry.

Developed for surface mount technology applications to simplify assembly processes

Provides a high degree of stability under various environmental conditions

Engineered for automotive and industrial applications which require robustness

Showcases a low temperature coefficient, enhancing long term precision

Supports a wide range of resistance values, catering to diverse circuit designs

Meets stringent RoHS compliance standards, ensuring eco friendliness

Includes sn termination on the Ni barrier layer for improved solderability

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