Wurth Elektronik, WE-MI, 0805 Unshielded Multilayer Surface Mount Inductor with a Ferrite Core, 100 nH Multilayer ±10 %
- RS庫存編號:
- 163-3374
- 製造零件編號:
- 7447902
- 製造商:
- Wurth Elektronik
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可享批量折扣
查看批量定價選項小計（1 卷，共 4000 件）*
TWD63,600.00
(不含稅)
TWD66,800.00
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2027年1月20日 發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每卷* |
|---|---|---|
| 4000 - 16000 | TWD15.90 | TWD63,600.00 |
| 20000 + | TWD15.40 | TWD61,600.00 |
* 參考價格
- RS庫存編號:
- 163-3374
- 製造零件編號:
- 7447902
- 製造商:
- Wurth Elektronik
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Wurth Elektronik | |
| Product Type | Multilayer Surface Mount Inductor | |
| Inductance | 100nH | |
| Maximum DC Current | 250mA | |
| Package/Case | 0805 | |
| Packaging | Tape & Reel | |
| Length | 2mm | |
| Automotive Standard | No | |
| Shielding | No | |
| Minimum Operating Temperature | -55°C | |
| Maximum DC Resistance | 300mΩ | |
| Inductance Tolerance | ±10 % | |
| Maximum Operating Temperature | 125°C | |
| Series | WE-MI | |
| Standards/Approvals | IEC 61249-2-21, JEDEC JS709B, REACH, RoHS | |
| Depth | 1.2mm | |
| Termination Style | Surface Mount | |
| Core Material | Ferrite | |
| Height | 900μm | |
| Maximum Self Resonant Frequency | 255MHz | |
| Inductor Construction | Multilayer | |
| Minimum Quality Factor | 20 | |
| 選取全部 | ||
|---|---|---|
品牌 Wurth Elektronik | ||
Product Type Multilayer Surface Mount Inductor | ||
Inductance 100nH | ||
Maximum DC Current 250mA | ||
Package/Case 0805 | ||
Packaging Tape & Reel | ||
Length 2mm | ||
Automotive Standard No | ||
Shielding No | ||
Minimum Operating Temperature -55°C | ||
Maximum DC Resistance 300mΩ | ||
Inductance Tolerance ±10 % | ||
Maximum Operating Temperature 125°C | ||
Series WE-MI | ||
Standards/Approvals IEC 61249-2-21, JEDEC JS709B, REACH, RoHS | ||
Depth 1.2mm | ||
Termination Style Surface Mount | ||
Core Material Ferrite | ||
Height 900μm | ||
Maximum Self Resonant Frequency 255MHz | ||
Inductor Construction Multilayer | ||
Minimum Quality Factor 20 | ||
- COO (Country of Origin):
- TW
Wurth Elektronik WE-MI Series Multilayer Surface Mount Inductor, 100nH Inductance, 125°C Maximum Operating Temperature - 7447902
This multilayer surface-mount inductor provides Compact inductance for PCB power and signal applications. It is designed for surface mounting in an 0805 package and operates across a wide temperature range suitable for many electronic assemblies. The component is supplied on tape and reel for automated placement and uses a ferrite core to deliver stable performance in small form-factor circuits.
Features and Benefits:
• 100nH inductance delivers predictable impedance for filtering
• Q≥20 ensures low loss at intended operating frequencies
• 255MHz self-resonant frequency supports high-frequency use
• 250mA DC current rating maintains performance under bias
• 300mΩ maximum DCR reduces series power dissipation
• Q≥20 ensures low loss at intended operating frequencies
• 255MHz self-resonant frequency supports high-frequency use
• 250mA DC current rating maintains performance under bias
• 300mΩ maximum DCR reduces series power dissipation
Applications
• Suitable for EMI suppression in Compact mixed-signal boards
• Ideal for decoupling in handheld power modules
• Used with radio-frequency front-end filtering stages
• Can be used for impedance matching in small RF circuits
• Ideal for decoupling in handheld power modules
• Used with radio-frequency front-end filtering stages
• Can be used for impedance matching in small RF circuits
What temperature range can it operate within?
It functions from -55°C up to 125°C.
How is the component packaged for production assembly?
It is delivered on tape and reel compatible with automated pick-and-place machines.
What termination and mounting style does it use?
It uses surface-mount terminations designed for reflow soldering.
What materials and construction affect its magnetic behaviour?
A ferrite core within a multilayer construction determines permeability and stability.
Is the device shielded against stray fields?
It is unshielded, relying on package design and placement for field management.
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