Wurth Elektronik, WE-CBF, 0603 Shielded Multilayer Surface Mount Inductor with a Ferrite Core, Multilayer 200 mA Idc
- RS庫存編號:
- 144-9794
- 製造零件編號:
- 74279266
- 製造商:
- Wurth Elektronik
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TWD13,600.00
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TWD14,280.00
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單位 | 每單位 | 每卷* | 節省 |
|---|---|---|---|
| 4000 - 16000 | TWD3.40 | TWD13,600.00 | - |
| 20000 + | TWD3.00 | TWD12,000.00 | 11% |
* 參考價格
- RS庫存編號:
- 144-9794
- 製造零件編號:
- 74279266
- 製造商:
- Wurth Elektronik
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Wurth Elektronik | |
| Product Type | Multilayer Surface Mount Inductor | |
| Maximum DC Current | 200mA | |
| Package/Case | 0603 | |
| Length | 1.6mm | |
| Packaging | Tape & Reel | |
| Automotive Standard | No | |
| Shielding | Yes | |
| Maximum DC Resistance | 600mΩ | |
| Minimum Operating Temperature | -55°C | |
| Pin Count | 2 | |
| Series | WE-CBF | |
| Maximum Operating Temperature | 125°C | |
| Depth | 800μm | |
| Core Material | Ferrite | |
| Termination Style | Surface Mount | |
| Standards/Approvals | IEC 60286-3:2013 | |
| Height | 800μm | |
| Moulded | Yes | |
| Inductor Construction | Multilayer | |
| 選取全部 | ||
|---|---|---|
品牌 Wurth Elektronik | ||
Product Type Multilayer Surface Mount Inductor | ||
Maximum DC Current 200mA | ||
Package/Case 0603 | ||
Length 1.6mm | ||
Packaging Tape & Reel | ||
Automotive Standard No | ||
Shielding Yes | ||
Maximum DC Resistance 600mΩ | ||
Minimum Operating Temperature -55°C | ||
Pin Count 2 | ||
Series WE-CBF | ||
Maximum Operating Temperature 125°C | ||
Depth 800μm | ||
Core Material Ferrite | ||
Termination Style Surface Mount | ||
Standards/Approvals IEC 60286-3:2013 | ||
Height 800μm | ||
Moulded Yes | ||
Inductor Construction Multilayer | ||
- COO (Country of Origin):
- TW
Wurth Elektronik WE-CBF Series Multilayer Surface Mount Inductor, 200mA Maximum DC Current, 600mΩ Maximum DC Resistance - 74279266
This multilayer surface-mount inductor provides low-current magnetic filtering in Compact SMD assemblies and operates across a wide temperature range. It is a moulded, shielded ferrite component designed for placement on printed circuit boards using tape-and-reel packaging, suitable for applications requiring a small footprint and stable performance under thermal stress.
Features and Benefits:
• Up to 200mA current rating enables low-current signal filtering
• 600mΩ RDC limits voltage drop in low-power circuits
• Shielded construction reduces electromagnetic interference
• Ferrite core material improves inductance stability with temperature
• Tape-and-reel packaging supports automated placement
• 600mΩ RDC limits voltage drop in low-power circuits
• Shielded construction reduces electromagnetic interference
• Ferrite core material improves inductance stability with temperature
• Tape-and-reel packaging supports automated placement
Applications
• Suitable for power‑line noise suppression in control modules
• Ideal for signal conditioning in Compact consumer electronics
• Used with precision analogue front‑ends requiring low leakage
• Can be used for EMI mitigation in communication interfaces
• Ideal for signal conditioning in Compact consumer electronics
• Used with precision analogue front‑ends requiring low leakage
• Can be used for EMI mitigation in communication interfaces
What mounting style does it use?
It is offered with surface-mount terminations for SMD assembly.
What package size should be planned for footprint design?
The component uses an 0603 package case intended for Compact board layouts.
How does it behave across temperature extremes?
It is specified to function between -55°C and 125°C for broad thermal operation.
Is the component moulded or an open construction?
The device is moulded and incorporates shielding for mechanical protection and EMI control.
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