onsemi 30 V 100 mA Schottky Barrier Diode Schottky 2-Pin DSN0201 NSR01L30NXT5G
- RS庫存編號:
- 184-1053
- 製造零件編號:
- NSR01L30NXT5G
- 製造商:
- onsemi
此圖片僅供參考,請參閲產品詳細資訊及規格
可享批量折扣
查看批量定價選項小計(1 卷,共 5000 件)*
TWD15,500.00
(不含稅)
TWD16,300.00
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2027年1月28日 發貨
**需要更多嗎?**輸入您需要的數量,然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每卷* |
|---|---|---|
| 5000 - 5000 | TWD3.10 | TWD15,500.00 |
| 10000 + | TWD3.10 | TWD15,500.00 |
* 參考價格
- RS庫存編號:
- 184-1053
- 製造零件編號:
- NSR01L30NXT5G
- 製造商:
- onsemi
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | onsemi | |
| Product Type | Schottky Barrier Diode | |
| Mount Type | Surface | |
| Package Type | DSN0201 | |
| Maximum Continuous Forward Current If | 100mA | |
| Peak Reverse Repetitive Voltage Vrrm | 30V | |
| Diode Configuration | Single | |
| Series | NSR01L30 | |
| Rectifier Type | Schottky | |
| Pin Count | 2 | |
| Maximum Forward Voltage Vf | -400mV | |
| Peak Non-Repetitive Forward Surge Current Ifsm | 4A | |
| Minimum Operating Temperature | -40°C | |
| Peak Reverse Current Ir | -0.2μA | |
| Maximum Operating Temperature | 125°C | |
| Width | 0.3mm | |
| Standards/Approvals | No | |
| Length | 0.6mm | |
| Height | 0.29mm | |
| Automotive Standard | No | |
| 選取全部 | ||
|---|---|---|
品牌 onsemi | ||
Product Type Schottky Barrier Diode | ||
Mount Type Surface | ||
Package Type DSN0201 | ||
Maximum Continuous Forward Current If 100mA | ||
Peak Reverse Repetitive Voltage Vrrm 30V | ||
Diode Configuration Single | ||
Series NSR01L30 | ||
Rectifier Type Schottky | ||
Pin Count 2 | ||
Maximum Forward Voltage Vf -400mV | ||
Peak Non-Repetitive Forward Surge Current Ifsm 4A | ||
Minimum Operating Temperature -40°C | ||
Peak Reverse Current Ir -0.2μA | ||
Maximum Operating Temperature 125°C | ||
Width 0.3mm | ||
Standards/Approvals No | ||
Length 0.6mm | ||
Height 0.29mm | ||
Automotive Standard No | ||
The Schottky diode is optimized for low forward voltage drop and low leakage current. The DSN-2 (Dual Silicon No-lead) package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN style package enables 100 percent utilization of the package area for active silicon, offering a significant performance per board area advantage compared to products in plastic molded packages.
Low Forward Voltage Drop
Low Reverse Current
Very High Switching Speed
Reverse Voltage and Current Protection
Reduces Power Dissipation
Applications:
LCD and Keypad Backlighting
Camera Photo Flash
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