STMicroelectronics LPS22HBTR MEMS Pressure SensorSurface 10 HLGA
- RS庫存編號:
- 111-6455P
- 製造零件編號:
- LPS22HBTR
- 製造商:
- STMicroelectronics
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- RS庫存編號:
- 111-6455P
- 製造零件編號:
- LPS22HBTR
- 製造商:
- STMicroelectronics
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | STMicroelectronics | |
| Sensor Type | Absolute Pressure Sensor | |
| Product Type | MEMS Pressure Sensor | |
| Maximum Overload Pressure | 2000kPa | |
| Mount Type | Surface | |
| Package Type | HLGA | |
| Pin Count | 10 | |
| Minimum Supply Voltage | 1.7V | |
| Maximum Operating Pressure | 126 kPa | |
| Maximum Supply Voltage | 3.6V | |
| Accuracy | ±0.1 hPa | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | ECOPACK lead-free | |
| Series | LPS22HB | |
| Maximum Output Voltage | 6.7V | |
| Length | 2mm | |
| Height | 0.76mm | |
| Minimum Operating Pressure | 26kPa | |
| Minimum Output Voltage | 5.7V | |
| Minimum Operating Temperature | -40°C | |
| Automotive Standard | No | |
| 選取全部 | ||
|---|---|---|
品牌 STMicroelectronics | ||
Sensor Type Absolute Pressure Sensor | ||
Product Type MEMS Pressure Sensor | ||
Maximum Overload Pressure 2000kPa | ||
Mount Type Surface | ||
Package Type HLGA | ||
Pin Count 10 | ||
Minimum Supply Voltage 1.7V | ||
Maximum Operating Pressure 126 kPa | ||
Maximum Supply Voltage 3.6V | ||
Accuracy ±0.1 hPa | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals ECOPACK lead-free | ||
Series LPS22HB | ||
Maximum Output Voltage 6.7V | ||
Length 2mm | ||
Height 0.76mm | ||
Minimum Operating Pressure 26kPa | ||
Minimum Output Voltage 5.7V | ||
Minimum Operating Temperature -40°C | ||
Automotive Standard No | ||
- COO (Country of Origin):
- MT
MEMS Pressure Sensor: Digital Barometer, STMicroelectronics
This is an ultra-compact absolute piezo-resistive pressure sensor with a high-resolution sensing element and embedded temperature compensation. Digital pressure, temperature data and register control communication is through the SPI and I²C interfaces. The pressure sensors are designed with “ST’s VENSENS technology” allowing the fabrication of pressure sensor on a monolithic silicon chip. This will eliminate wafer-to-wafer bonding and maximise reliability.
These pressure sensors use innovative MEMS (Micro Electro-Mechanical Systems) to provide an extremely high pressure resolution in an ultra-compact and thin package. Pressure sensors are becoming increasingly used in tablets, smartphones, and wearable technology. With them becoming increasingly popular in smartphones, it opens the door to new applications such as weather analysers, health and sports monitors.
• Key technical features –
• Enhanced temperature compensation
• Absolute pressure range from 260 to 1260 hPa
• Lower power consumption, less the 4μA
• Pressure noise lower than 1Pa RMS
• Embedded FIFO
Pressure Sensors, STMicroelectronics
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