Infineon ISO1H815GAUMA1 High Side 8, High Side Power Switch Power Switch IC 36-Pin, DSO

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包裝方式:
RS庫存編號:
906-4501
製造零件編號:
ISO1H815GAUMA1
製造商:
Infineon
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品牌

Infineon

Power Switch Type

High Side Power Switch

Power Switch Topology

High Side

Product Type

Power Switch IC

Switch On Resistance RdsOn

320mΩ

Number of Outputs

8

Number of Inputs

8

Mount Type

Surface

Package Type

DSO

Minimum Supply Voltage

-0.5V

Pin Count

36

Maximum Supply Voltage

6.5V

Operating Current

1.4A

Minimum Operating Temperature

-25°C

Maximum Operating Temperature

125°C

Standards/Approvals

No

Height

3.5mm

Length

15.9mm

Width

11mm

Series

ISOFACE

Automotive Standard

No

豁免

Infineon ISOFACE Series Power Switch IC, 6.5V Maximum Supply Voltage, 1.4A Operating Current - ISO1H815GAUMA1


This power switch IC is an eight-channel high-side switch designed for multi-output control in electronic assemblies. It provides individual input-to-output switching capability for moderate currents, suited to surface-mounted board designs where compact, controllable power distribution is required. The device operates across a broad temperature span and supports low-voltage systems up to a specific supply limit.

Features and Benefits:


• 8 outputs with 8 inputs enabling multi-load control
• 1.4A operating current for moderate load handling
• 320mΩ Rds(on) reducing conduction losses
• 6.5V maximum supply voltage compatible with low-voltage systems
• -25°C to 125°C temperature range for varied thermal environments
• 36 pins in a DSO package for dense PCB integration

Applications


• Suitable for controlling lighting arrays in compact electronics
• Ideal for driving solenoids or small actuators on boards
• Used with battery-powered modules requiring multiple switched outputs
• Can be used for power sequencing in embedded control units
• Appropriate for industrial control panels with surface-mount assemblies

What mounting style is required for integration onto boards?


It employs surface-mount construction, so reflow soldering to a compatible footprint is expected.

How large is the package for board layout considerations?


The device occupies a compact footprint measuring 15.9mm in length, 11mm in width and 3.5mm in height.

What thermal limits should designers accommodate?


The component functions between -25°C and 125°C, so thermal management must keep temperatures within this span.

How many connections are available for signal routing?


There are 36 pins providing input, output and supply connections for circuit interfacing.

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