Infineon BSP76E6433HUMA1 Low Side 1, Low Side Power Switch Power Switch IC 4-Pin, SOT-223

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包裝方式:
RS庫存編號:
898-6876
Distrelec 貨號:
304-44-420
製造零件編號:
BSP76E6433HUMA1
製造商:
Infineon
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品牌

Infineon

Power Switch Topology

Low Side

Power Switch Type

Low Side Power Switch

Product Type

Power Switch IC

Switch On Resistance RdsOn

480mΩ

Power Rating

3.8W

Number of Inputs

1

Mount Type

Surface

Package Type

SOT-223

Minimum Supply Voltage

-0.2V

Pin Count

4

Maximum Supply Voltage

10V

Operating Current

1.4A

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

150°C

Standards/Approvals

No

Height

1.6mm

Length

6.5mm

Automotive Standard

No

Series

HITFET

Infineon HITFET Series Power Switch IC, 3.8W Power Rating, 1.4A Operating Current - BSP76E6433HUMA1


This power switch IC is a low-side semiconductor device designed for switching and protection roles in electronic systems. It operates from a low-voltage supply and is intended for surface-mount placement on PCB assemblies where controlled low-side switching of loads is required. The component is suitable for environments demanding wide temperature tolerance and compact packaging.

Features and Benefits:


• 480mΩ Rds(on) delivers low conduction losses under load
• 10V maximum supply enables compatibility with common low-voltage systems
• 1.4A operating current supports moderate continuous load currents
• 3.8W thermal rating allows sustained power dissipation handling
• -40°C to 150°C temperature range enables high-temperature operation
• 4-pin SOT-223 surface-mount package simplifies PCB assembly

Applications


• Suitable for switching resistive and small inductive loads
• Ideal for centralised load distribution in control modules
• Used with low-voltage actuators and solenoids in equipment
• Can be used for sequencing multiple outputs from one input
• Used for board-level load protection in rugged electronics

How many control inputs and switched outputs does it support?


It accepts a single control input and provides five independent switched outputs for distributing one command to multiple loads.

What mounting considerations are required for thermal performance?


Use a PCB layout with thermal land and copper pours beneath the SOT-223 pad to improve heat sinking and maintain the device within its thermal dissipation capability.

What topology does it implement and what is the functional implication?


It implements a low-side switching topology, meaning the device switches the connection of the load to ground and is best placed between the load and return path.

What pin count should designers expect when integrating it?


The package exposes four pins, which must be routed according to the schematic for input control, ground return and multiple output connections.

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