Vishay SIP32434BDN-T1E4 High Side 1, Load Switch Power Switch IC 10-Pin, DFN-10
- RS庫存編號:
- 240-5289
- 製造零件編號:
- SIP32434BDN-T1E4
- 製造商:
- Vishay
可享批量折扣
查看批量定價選項小計(1 包,共 10 件)*
TWD362.00
(不含稅)
TWD380.10
(含稅)
訂單超過 $1,300.00 免費送貨
有庫存
- 加上 5,500 件從 2026年10月19日 起發貨
**需要更多嗎?**輸入您需要的數量,然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每包* |
|---|---|---|
| 10 - 40 | TWD36.20 | TWD362.00 |
| 50 - 90 | TWD35.40 | TWD354.00 |
| 100 - 240 | TWD35.00 | TWD350.00 |
| 250 - 990 | TWD34.20 | TWD342.00 |
| 1000 + | TWD33.70 | TWD337.00 |
* 參考價格
- RS庫存編號:
- 240-5289
- 製造零件編號:
- SIP32434BDN-T1E4
- 製造商:
- Vishay
規格
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Vishay | |
| Power Switch Type | Load Switch | |
| Power Switch Topology | High Side | |
| Product Type | Power Switch IC | |
| Switch On Resistance RdsOn | 33mΩ | |
| Number of Outputs | 5 | |
| Number of Inputs | 1 | |
| Mount Type | Surface | |
| Minimum Supply Voltage | 2.8V | |
| Package Type | DFN-10 | |
| Pin Count | 10 | |
| Maximum Supply Voltage | 23V | |
| Maximum Operating Temperature | 150°C | |
| Operating Current | 6A | |
| Minimum Operating Temperature | -40°C | |
| Length | 3mm | |
| Width | 3mm | |
| Standards/Approvals | No | |
| Series | SiP32434 | |
| Automotive Standard | No | |
| 選取全部 | ||
|---|---|---|
品牌 Vishay | ||
Power Switch Type Load Switch | ||
Power Switch Topology High Side | ||
Product Type Power Switch IC | ||
Switch On Resistance RdsOn 33mΩ | ||
Number of Outputs 5 | ||
Number of Inputs 1 | ||
Mount Type Surface | ||
Minimum Supply Voltage 2.8V | ||
Package Type DFN-10 | ||
Pin Count 10 | ||
Maximum Supply Voltage 23V | ||
Maximum Operating Temperature 150°C | ||
Operating Current 6A | ||
Minimum Operating Temperature -40°C | ||
Length 3mm | ||
Width 3mm | ||
Standards/Approvals No | ||
Series SiP32434 | ||
Automotive Standard No | ||
Vishay SiP32434 Series Power Switch IC, 6A Operating Current, 23V Maximum Supply Voltage - SIP32434BDN-T1E4
This power switch IC is a compact high‑side load switch designed to manage multiple outputs from a single input in low‑ to mid‑voltage systems. It functions as a multi‑channel power distribution device for electronic assemblies where controlled sequencing and protection of several rails is required. The component is packaged for surface‑mount assembly and is intended for applications demanding concentrated switching capability in a small footprint.
Features and Benefits:
• Low conduction loss with 33mΩ Rds(on) for efficient operation
• Supports up to 6A total operating current for higher load demands
• Accepts supply voltages from 2.8V to 23V for broad voltage compatibility
• Contains five independently controlled outputs to simplify power routing
• Ten‑pin DFN package enables space‑saving surface‑mount integration
• Rated to 150°C maximum operating temperature for elevated thermal conditions
• Supports up to 6A total operating current for higher load demands
• Accepts supply voltages from 2.8V to 23V for broad voltage compatibility
• Contains five independently controlled outputs to simplify power routing
• Ten‑pin DFN package enables space‑saving surface‑mount integration
• Rated to 150°C maximum operating temperature for elevated thermal conditions
Applications
• Suitable for powering multiple peripheral rails on handheld devices
• Ideal for centralised power distribution in industrial modules
• Used with battery management systems requiring multi‑output sequencing
• Can be used for sequencing power to sensors and communication ICs
• Suitable for compact assemblies where board space is limited
• Ideal for centralised power distribution in industrial modules
• Used with battery management systems requiring multi‑output sequencing
• Can be used for sequencing power to sensors and communication ICs
• Suitable for compact assemblies where board space is limited
What input arrangement does it use to feed multiple outputs?
It employs a single input channel that supplies five output switches, enabling one‑source distribution to several loads.
How does the package support PCB assembly and thermal performance?
The component is supplied in a 10‑pin DFN surface‑mount package that facilitates low‑profile placement and improved thermal conduction to the board.
What environmental limits should designers consider for reliability?
The device is rated to operate between -40°C and 150°C, which should be considered when specifying cooling and enclosure conditions.
Can it handle continuous heavy current in compact designs?
With a 6A operating current rating and a low Rds(on) of 33mΩ, it is suitable for sustained higher‑current loads within its thermal limits.
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