Hirose DF23 Series Straight Surface PCB Socket, 30-Contact, 2 Row, 0.5 mm Pitch Solder
- RS庫存編號:
- 724-1019
- 製造零件編號:
- DF23C-30DS-0.5V(51)
- 製造商:
- Hirose
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
小計（1 包，共 10 件）*
TWD261.00
(不含稅)
TWD274.00
(含稅)
庫存資訊目前無法存取 - 請稍後再回來查看
單位 | 每單位 | 每包* |
|---|---|---|
| 10 - 490 | TWD26.10 | TWD261.00 |
| 500 - 990 | TWD25.60 | TWD256.00 |
| 1000 + | TWD25.00 | TWD250.00 |
* 參考價格
- RS庫存編號:
- 724-1019
- 製造零件編號:
- DF23C-30DS-0.5V(51)
- 製造商:
- Hirose
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Hirose | |
| Product Type | PCB Socket | |
| Number of Contacts | 30 | |
| Number of Rows | 2 | |
| Pitch | 0.5mm | |
| Current | 300mA | |
| Termination Type | Solder | |
| Housing Material | Liquid Crystal Polymer | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Stacking Height | 1.5mm | |
| Connector System | Board-to-Board, Board-to-FPC | |
| Voltage | 50V | |
| Series | DF23 | |
| Minimum Operating Temperature | -35°C | |
| Row Pitch | 4.4mm | |
| Contact Material | Copper | |
| Contact Plating | Gold | |
| Contact Gender | Female | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | No | |
| 選取全部 | ||
|---|---|---|
品牌 Hirose | ||
Product Type PCB Socket | ||
Number of Contacts 30 | ||
Number of Rows 2 | ||
Pitch 0.5mm | ||
Current 300mA | ||
Termination Type Solder | ||
Housing Material Liquid Crystal Polymer | ||
Mount Type Surface | ||
Orientation Straight | ||
Stacking Height 1.5mm | ||
Connector System Board-to-Board, Board-to-FPC | ||
Voltage 50V | ||
Series DF23 | ||
Minimum Operating Temperature -35°C | ||
Row Pitch 4.4mm | ||
Contact Material Copper | ||
Contact Plating Gold | ||
Contact Gender Female | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals No | ||
- COO (Country of Origin):
- JP
Hirose DF23 series
Hirose DF23 series 0.5mm Pitch Low-Profile Board-to-Board / Board-to-FPC Connectors
Features and Benefits
• 1.5 mm board-to-board distance
• Click sensation
• High contact reliability
• Large self-alignment
• Board placement with automatic equipment
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