Samtec CLP Series Straight Surface PCB Socket, 20-Contact, 2 Row, 1.27 mm Pitch Solder
- RS庫存編號:
- 227-1069
- 製造零件編號:
- CLP-110-02-S-D-K-TR
- 製造商:
- Samtec
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小計（1 件）*
TWD162.00
(不含稅)
TWD170.10
(含稅)
添加 9 件 件可免費送貨
暫時缺貨
- 從 2026年3月23日 發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 |
|---|---|
| 1 - 9 | TWD162.00 |
| 10 - 24 | TWD158.00 |
| 25 - 49 | TWD152.00 |
| 50 - 99 | TWD149.00 |
| 100 + | TWD146.00 |
* 參考價格
- RS庫存編號:
- 227-1069
- 製造零件編號:
- CLP-110-02-S-D-K-TR
- 製造商:
- Samtec
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Samtec | |
| Number of Contacts | 20 | |
| Product Type | PCB Socket | |
| Sub Type | Reliable Dual Wipe Socket Strip | |
| Number of Rows | 2 | |
| Current | 3.4A | |
| Pitch | 1.27mm | |
| Housing Material | Liquid Crystal Polymer | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Connector System | Board-to-Board | |
| Voltage | 395 V | |
| Series | CLP | |
| Row Pitch | 1.27mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Plating | Gold | |
| Contact Material | Phosphor Bronze | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | No | |
| 選取全部 | ||
|---|---|---|
品牌 Samtec | ||
Number of Contacts 20 | ||
Product Type PCB Socket | ||
Sub Type Reliable Dual Wipe Socket Strip | ||
Number of Rows 2 | ||
Current 3.4A | ||
Pitch 1.27mm | ||
Housing Material Liquid Crystal Polymer | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Straight | ||
Connector System Board-to-Board | ||
Voltage 395 V | ||
Series CLP | ||
Row Pitch 1.27mm | ||
Minimum Operating Temperature -55°C | ||
Contact Plating Gold | ||
Contact Material Phosphor Bronze | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals No | ||
The Samtec CLP series 1.27mm low profile dual wipe socket has 10 positions and surface mount lead style. It has 0.000762mm selective gold in contact area and matte tin on tail.
Dual row
Bottom entry style
Polyimide film pick & place pad
Tape and reel packaging
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