Samtec CLP Series Horizontal Surface PCB Socket, 12-Contact, 2 Row, 1.27 mm Pitch Solder

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小計(1 卷,共 1050 件)*

TWD74,130.00

(不含稅)

TWD77,836.50

(含稅)

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  • 2026年2月19日 發貨
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每單位
每卷*
1050 - 4200TWD70.60TWD74,130.00
5250 +TWD68.50TWD71,925.00

* 參考價格

RS庫存編號:
227-1040
製造零件編號:
CLP-106-02-G-D-BE-A-K-TR
製造商:
Samtec
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品牌

Samtec

Product Type

PCB Socket

Number of Contacts

12

Number of Rows

2

Sub Type

Dual Wipe Socket

Current

3.4A

Pitch

1.27mm

Housing Material

Liquid Crystal Polymer

Termination Type

Solder

Mount Type

Surface

Orientation

Horizontal

Connector System

Board-to-Board

Voltage

395 V

Series

CLP

Row Pitch

1.27mm

Minimum Operating Temperature

-55°C

Contact Material

Phosphor Bronze

Maximum Operating Temperature

125°C

Contact Plating

Gold

Standards/Approvals

No

The Samtec CLP series 1.27mm low profile dual wipe socket has 6 positions and surface mount lead style. It has 0.000254mm gold in contact area and 0.0000762mm on tail.

Dual row

Bottom entry style

Alignment pins

Polyimide film pick & place pad

Tape and reel packaging

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