Samtec ASP Series Straight Surface PCB Socket, 160-Contact, 2 Row, 0.5 mm Pitch Solder
- RS庫存編號:
- 180-4604
- 製造零件編號:
- ASP-122952-01
- 製造商:
- Samtec
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
小計（1 托盤，共 42 件）*
TWD15,729.00
(不含稅)
TWD16,515.24
(含稅)
添加 42 件 件可免費送貨
暫時缺貨
- 從 2026年3月23日 發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每托盤* |
|---|---|---|
| 42 - 168 | TWD374.50 | TWD15,729.00 |
| 210 + | TWD367.00 | TWD15,414.00 |
* 參考價格
- RS庫存編號:
- 180-4604
- 製造零件編號:
- ASP-122952-01
- 製造商:
- Samtec
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Samtec | |
| Number of Contacts | 160 | |
| Product Type | PCB Socket | |
| Number of Rows | 2 | |
| Sub Type | Terminal Assembly | |
| Current | 2.7A | |
| Pitch | 0.5mm | |
| Termination Type | Solder | |
| Housing Material | Liquid Crystal Polymer | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Connector System | Board-to-Board | |
| Stacking Height | 10mm | |
| Voltage | 339 V | |
| Series | ASP | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 6.18mm | |
| Contact Plating | Gold over Nickel | |
| Contact Material | Bronze | |
| Maximum Operating Temperature | 125°C | |
| Contact Gender | Male | |
| Standards/Approvals | RoHS | |
| 選取全部 | ||
|---|---|---|
品牌 Samtec | ||
Number of Contacts 160 | ||
Product Type PCB Socket | ||
Number of Rows 2 | ||
Sub Type Terminal Assembly | ||
Current 2.7A | ||
Pitch 0.5mm | ||
Termination Type Solder | ||
Housing Material Liquid Crystal Polymer | ||
Mount Type Surface | ||
Orientation Straight | ||
Connector System Board-to-Board | ||
Stacking Height 10mm | ||
Voltage 339 V | ||
Series ASP | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 6.18mm | ||
Contact Plating Gold over Nickel | ||
Contact Material Bronze | ||
Maximum Operating Temperature 125°C | ||
Contact Gender Male | ||
Standards/Approvals RoHS | ||
- COO (Country of Origin):
- CR
Altera® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in today’s FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.
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