Samtec ASP Series Straight Surface PCB Socket, 50-Contact, 2 Row, 0.8 mm Pitch Solder
- RS庫存編號:
- 180-2773
- 製造零件編號:
- ASP-148422-01
- 製造商:
- Samtec
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
小計（1 件）*
TWD210.00
(不含稅)
TWD220.50
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2026年3月02日 發貨
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單位 | 每單位 |
|---|---|
| 1 - 93 | TWD210.00 |
| 94 - 187 | TWD205.00 |
| 188 + | TWD201.00 |
* 參考價格
- RS庫存編號:
- 180-2773
- 製造零件編號:
- ASP-148422-01
- 製造商:
- Samtec
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Samtec | |
| Product Type | PCB Socket | |
| Number of Contacts | 50 | |
| Number of Rows | 2 | |
| Sub Type | Socket Assembly | |
| Current | 2.7A | |
| Pitch | 0.8mm | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Connector System | Board-to-Board | |
| Stacking Height | 22mm | |
| Voltage | 339 V | |
| Series | ASP | |
| Row Pitch | 3.36mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Gender | Female | |
| Contact Plating | Gold over Nickel | |
| Contact Material | Beryllium Copper Alloy | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | RoHS | |
| 選取全部 | ||
|---|---|---|
品牌 Samtec | ||
Product Type PCB Socket | ||
Number of Contacts 50 | ||
Number of Rows 2 | ||
Sub Type Socket Assembly | ||
Current 2.7A | ||
Pitch 0.8mm | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Straight | ||
Connector System Board-to-Board | ||
Stacking Height 22mm | ||
Voltage 339 V | ||
Series ASP | ||
Row Pitch 3.36mm | ||
Minimum Operating Temperature -55°C | ||
Contact Gender Female | ||
Contact Plating Gold over Nickel | ||
Contact Material Beryllium Copper Alloy | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals RoHS | ||
The Samtec PCB Socket ASP series is a surface mount PCB socket. As advances in semiconductor and system design continue, embedded applications are using higher performance embedded processors. Efficient use of these embedded processors requires software and hardware development tools that can easily access critical processor functionality.
Contact Plating: Gold over Nickel
Contact Material: Beryllium Copper
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