Molex PMC Mezzanine Series Straight Surface Edge Connector, 64-Contact, 2 Row, 1 mm Pitch Solder
- RS庫存編號:
- 161-8007
- 製造零件編號:
- 71439-0164
- 製造商:
- Molex
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
查看批量定價選項小計（1 管，共 588 件）*
TWD127,948.80
(不含稅)
TWD134,346.24
(含稅)
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單位 | 每單位 | 每管* |
|---|---|---|
| 588 - 2352 | TWD217.60 | TWD127,948.80 |
| 2940 + | TWD211.10 | TWD124,126.80 |
* 參考價格
- RS庫存編號:
- 161-8007
- 製造零件編號:
- 71439-0164
- 製造商:
- Molex
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Product Type | Edge Connector | |
| Number of Contacts | 64 | |
| Number of Rows | 2 | |
| Sub Type | Board-to-Board | |
| Pitch | 1mm | |
| Current | 12A | |
| Housing Material | Thermoplastic | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Connector System | Board-to-Board, Signal | |
| Voltage | 100V | |
| Series | PMC Mezzanine | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 1.4mm | |
| Contact Plating | Gold | |
| Contact Gender | Female | |
| Maximum Operating Temperature | 85°C | |
| Contact Material | Bronze | |
| Standards/Approvals | No | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Product Type Edge Connector | ||
Number of Contacts 64 | ||
Number of Rows 2 | ||
Sub Type Board-to-Board | ||
Pitch 1mm | ||
Current 12A | ||
Housing Material Thermoplastic | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Straight | ||
Connector System Board-to-Board, Signal | ||
Voltage 100V | ||
Series PMC Mezzanine | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 1.4mm | ||
Contact Plating Gold | ||
Contact Gender Female | ||
Maximum Operating Temperature 85°C | ||
Contact Material Bronze | ||
Standards/Approvals No | ||
- COO (Country of Origin):
- CN
Vertical Stacking SMT Headers & Sockets 64 Way
A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Approvals
UL recognised component
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