TE Connectivity AMPMODU System 50 Series Straight Surface PCB Socket, 40-Contact, 2 Row, 1.27 mm Pitch Solder

RS庫存編號:: 406-855
Distrelec 貨號:: 302-70-329
製造零件編號:: 5-104652-4
製造商:: TE Connectivity

TE Connectivity AMPMODU System 50 Series Straight Surface PCB Socket, 40-Contact, 2 Row, 1.27 mm Pitch Solder

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小計（1 件）*

TWD380.00

(不含稅)

TWD399.00

訂單超過 $1,300.00 免費送貨

暫時缺貨

從 2027年1月25日發貨

**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。

單位	每單位
1 - 4	TWD380.00
5 - 6	TWD373.00
7 - 9	TWD359.00
10 - 16	TWD350.00
17 +	TWD341.00

* 參考價格

RS庫存編號:: 406-855
Distrelec 貨號:: 302-70-329
製造零件編號:: 5-104652-4
製造商:: TE Connectivity

規格

產品概覽和技術數據資料表

法例與合規

產品詳細資訊

透過選取一個或多個屬性來查找類似產品。

選取全部	屬性	值
	品牌	TE Connectivity
	Number of Contacts	40
	Product Type	PCB Socket
	Sub Type	Socket Strip
	Number of Rows	2
	Current	12A
	Pitch	1.27mm
	Termination Type	Solder
	Housing Material	Liquid Crystal Polymer
	Mount Type	Surface
	Orientation	Straight
	Connector System	Board-to-Board
	Voltage	30 V
	Series	AMPMODU System 50
	Minimum Operating Temperature	-40°C
	Row Pitch	2.54mm
	Contact Plating	Gold
	Contact Material	Copper
	Maximum Operating Temperature	105°C
	Contact Gender	Female
	Standards/Approvals	No

	選取全部
	品牌 TE Connectivity
	Number of Contacts 40
	Product Type PCB Socket
	Sub Type Socket Strip
	Number of Rows 2
	Current 12A
	Pitch 1.27mm
	Termination Type Solder
	Housing Material Liquid Crystal Polymer
	Mount Type Surface
	Orientation Straight
	Connector System Board-to-Board
	Voltage 30 V
	Series AMPMODU System 50
	Minimum Operating Temperature -40°C
	Row Pitch 2.54mm
	Contact Plating Gold
	Contact Material Copper
	Maximum Operating Temperature 105°C
	Contact Gender Female
	Standards/Approvals No

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TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Grid Board to Board Vertical Receptacles

AMPMODU 50/50 1.27mm x 1.27mm grid board to board vertical receptacles for SMT parallel board to board stacking in high density .050 x .050 applications. Parallel board to board stack heights of 6.35mm, 8.13mm and 9.91mm can by achieved using the same receptacle and selecting the appropriate header (board to board .050 x.050 double row vertical and right angle headers). These AMPMODU 50/50 1.27mm x 1.27mm vertical SMT board to board receptacle connectors have UL 94V-0 black glass filled thermoplastic housings, PCB hold down posts, polarizing tabs, gold plated contacts and are compatible with IR (infrared) and VPR(vapour phase reflow) surface mount processes.

TE Connectivity AMPMODU 50/50 1.27mm Connectors

The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.

Approvals

UL 94V-0

TE Connectivity AMPMODU System 50 Series Straight Surface PCB Socket, 40-Contact, 2 Row, 1.27 mm Pitch Solder

訂單超過 $1,300.00 免費送貨

TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Grid Board to Board Vertical Receptacles

TE Connectivity AMPMODU 50/50 1.27mm Connectors

Approvals

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