Samtec SEAM Series Straight Surface PCB Header, 300 Contact(s), 1.27 mm Pitch, 10 Row, Shrouded
- RS庫存編號:
- 767-9022
- 製造零件編號:
- SEAM-30-02.0-S-10-2-A-K-TR
- 製造商:
- Samtec
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小計(1 件)*
TWD782.00
(不含稅)
TWD821.10
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2026年1月26日 發貨
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單位 | 每單位 |
|---|---|
| 1 - 19 | TWD782.00 |
| 20 + | TWD763.00 |
* 參考價格
- RS庫存編號:
- 767-9022
- 製造零件編號:
- SEAM-30-02.0-S-10-2-A-K-TR
- 製造商:
- Samtec
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Samtec | |
| Product Type | PCB Header | |
| Series | SEAM | |
| Pitch | 1.27mm | |
| Current | 2.7A | |
| Number of Contacts | 300 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Rows | 10 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface | |
| Connector System | Board-to-Board | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Row Pitch | 1.27mm | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 125°C | |
| Contact Gender | Male | |
| Standards/Approvals | No | |
| Voltage | 240 V | |
| 選取全部 | ||
|---|---|---|
品牌 Samtec | ||
Product Type PCB Header | ||
Series SEAM | ||
Pitch 1.27mm | ||
Current 2.7A | ||
Number of Contacts 300 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Rows 10 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface | ||
Connector System Board-to-Board | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Row Pitch 1.27mm | ||
Minimum Operating Temperature -55°C | ||
Termination Type Solder | ||
Maximum Operating Temperature 125°C | ||
Contact Gender Male | ||
Standards/Approvals No | ||
Voltage 240 V | ||
1.27mm SEARAY™ Series Interconnects
SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.
Various rows high density connectors suitable for board stacking applications
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area
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