Molex C-Grid Series Vertical Through Hole PCB Header, 30 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

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小計(1 包,共 5 件)*

TWD400.00

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TWD420.00

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5 - 10TWD80.00TWD400.00
15 - 25TWD78.20TWD391.00
30 +TWD77.00TWD385.00

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包裝方式:
RS庫存編號:
670-4452
Distrelec 貨號:
304-57-537
製造零件編號:
70246-3001
製造商:
Molex
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品牌

Molex

Product Type

PCB Header

Series

C-Grid

Pitch

2.54mm

Current

2.5A

Number of Contacts

30

Housing Material

Polybutylene Terephthalate

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Wire-to-Board

Contact Plating

Gold

Contact Material

Phosphor Bronze

Termination Type

Solder

Minimum Operating Temperature

-55°C

Row Pitch

2.54mm

Tail Pin Length

3.43mm

Contact Gender

Male

Maximum Operating Temperature

120°C

Standards/Approvals

No

Mating Pin Length

6.1mm

Voltage

250V

COO (Country of Origin):
MY

Molex C-Grid Series PCB Header, 2.5A Current Rating, 2.54mm Pitch - 70246-3001


This PCB header is designed to provide stable wire-to-board connections with a low-profile design, making it suitable for a variety of electronic applications, especially in automation, electrical, and mechanical sectors. Its shrouded structure enhances connection security and is vital for complex circuit designs.

Features & Benefits


• Gold plating improves conductivity and reduces oxidation

• Maximum voltage rating of 250V for various tasks

• Current capacity of up to 2.5A per contact for effective performance

Applications


• Suitable for industrial automation and electronic devices

• Ideal for low-profile connector

• Commonly found in consumer electronics and appliances

What type of termination method is used for installation?


This device employs a through-hole connection method to ensure stable mounting on printed circuit boards.

What is the recommended PCB thickness for optimal performance?


A PCB thickness of 1.60mm is advised to guarantee a secure fit and reliable connection.

How is the product packaged for distribution?


The product is packaged in trays, facilitating handling and transportation during manufacturing processes.

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