Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 1 Row, Shrouded
- RS庫存編號:
- 447-6906
- Distrelec 貨號:
- 304-42-707
- 製造零件編號:
- 43650-0415
- 製造商:
- Molex
此圖片僅供參考,請參閲產品詳細資訊及規格
可享批量折扣
小計(1 包,共 5 件)*
TWD132.00
(不含稅)
TWD138.60
(含稅)
訂單超過 $1,300.00 免費送貨
有庫存
- 1,255 件準備從其他地點送貨
- 加上 3,485 件從 2026年1月26日 起發貨
**需要更多嗎?**輸入您需要的數量,然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每包* |
|---|---|---|
| 5 - 120 | TWD26.40 | TWD132.00 |
| 125 - 495 | TWD25.60 | TWD128.00 |
| 500 - 1245 | TWD24.80 | TWD124.00 |
| 1250 - 2495 | TWD24.20 | TWD121.00 |
| 2500 + | TWD23.60 | TWD118.00 |
* 參考價格
- RS庫存編號:
- 447-6906
- Distrelec 貨號:
- 304-42-707
- 製造零件編號:
- 43650-0415
- 製造商:
- Molex
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Series | Micro-Fit 3.0 | |
| Product Type | PCB Header | |
| Current | 8.5A | |
| Pitch | 3mm | |
| Number of Contacts | 4 | |
| Housing Material | Thermoplastic | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Material | Brass | |
| Contact Plating | Tin | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Solder | |
| Row Pitch | 3mm | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | No | |
| Voltage | 600 V | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Series Micro-Fit 3.0 | ||
Product Type PCB Header | ||
Current 8.5A | ||
Pitch 3mm | ||
Number of Contacts 4 | ||
Housing Material Thermoplastic | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Material Brass | ||
Contact Plating Tin | ||
Minimum Operating Temperature -40°C | ||
Termination Type Solder | ||
Row Pitch 3mm | ||
Contact Gender Male | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals No | ||
Voltage 600 V | ||
Molex Micro-Fit 3.0 Series PCB Header, 8.5A Current Rating, 3mm Pitch - 43650-0415
This PCB header facilitates a dependable connection for wire-to-board applications, tailored for high-current situations. The Micro-Fit 3.0 structure features a shrouded design that improves the connector's compatibility and operational stability. With a current rating of 8.5A and a voltage rating of 600V, it meets the requirements of the automation, electronics, and electrical sectors.
Features & Benefits
• Tin plating provides corrosion resistance and conductivity
• Glow wire compliant for safety in elevated temperature environments
• High durability with 30 mating cycles for extended use
Applications
• Utilised in power distribution and control systems
• Suitable for automation equipment needing compact connectors
• Ideal for electronic devices requiring secure wire-to-board connections
What is the recommended PCB thickness for this connector?
The optimal PCB thickness for this connector is 1.60mm, ensuring effective retention and stability during operation.
Can it withstand high temperatures during soldering?
Yes, it can handle a maximum process temperature of 260°C for up to 30 seconds, making it suitable for lead-free solder processes.
How many circuits can this header accommodate?
This header supports up to 4 circuits, offering flexibility for various power and signal connection requirements.
Is it suitable for high-current applications?
Yes, with a maximum current rating of 8.5A per contact, it is appropriate for high-current PCB connections.
相關連結
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