Amphenol Communications Solutions Bergstik Series Vertical Surface Pin Header, 4 Contact(s), 2.54 mm Pitch, 1 Row,
- RS庫存編號:
- 236-4719
- 製造零件編號:
- 95293-101A04LF
- 製造商:
- Amphenol Communications Solutions
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
小計（1 組，共 10 件）*
TWD616.00
(不含稅)
TWD646.80
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2026年7月14日 發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每膠帶* |
|---|---|---|
| 10 - 40 | TWD61.60 | TWD616.00 |
| 50 - 90 | TWD60.00 | TWD600.00 |
| 100 + | TWD58.60 | TWD586.00 |
* 參考價格
- RS庫存編號:
- 236-4719
- 製造零件編號:
- 95293-101A04LF
- 製造商:
- Amphenol Communications Solutions
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Amphenol Communications Solutions | |
| Product Type | Pin Header | |
| Series | Bergstik | |
| Current | 3A | |
| Pitch | 2.54mm | |
| Housing Material | Thermoplastic | |
| Number of Contacts | 4 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Connector System | Board-to-Board | |
| Mount Type | Surface | |
| Contact Material | Phosphor Bronze | |
| Contact Plating | Gold | |
| Row Pitch | 2.54mm | |
| Minimum Operating Temperature | -65°C | |
| Termination Type | Solder | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | No | |
| Voltage | 1500 V | |
| 選取全部 | ||
|---|---|---|
品牌 Amphenol Communications Solutions | ||
Product Type Pin Header | ||
Series Bergstik | ||
Current 3A | ||
Pitch 2.54mm | ||
Housing Material Thermoplastic | ||
Number of Contacts 4 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Connector System Board-to-Board | ||
Mount Type Surface | ||
Contact Material Phosphor Bronze | ||
Contact Plating Gold | ||
Row Pitch 2.54mm | ||
Minimum Operating Temperature -65°C | ||
Termination Type Solder | ||
Contact Gender Male | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals No | ||
Voltage 1500 V | ||
- COO (Country of Origin):
- FR
The Amphenol ICC BergStik unshrouded header has 2.54 mm pitch provide board-to-board, wire-to-board and cable-to-board interconnect solutions for all types of electronic equipment and devices.
High temperature thermoplastic material
Reflow compatible
Variable spacing height for stacking headers
Cater to a wide range of applications
Allow dual entry, mating from top or bottom
Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements
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