Molex Micro-Fit Series Vertical Through Hole PCB Header, 2 Contact(s), 3 mm Pitch, 1 Row, Shrouded
- RS庫存編號:
- 228-2583
- Distrelec 貨號:
- 304-40-631
- 製造零件編號:
- 216571-1002
- 製造商:
- Molex
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- RS庫存編號:
- 228-2583
- Distrelec 貨號:
- 304-40-631
- 製造零件編號:
- 216571-1002
- 製造商:
- Molex
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Product Type | PCB Header | |
| Series | Micro-Fit | |
| Current | 13A | |
| Pitch | 3mm | |
| Number of Contacts | 2 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Micro Fit Connector System | |
| Mount Type | Through Hole | |
| Contact Plating | Matt Tin | |
| Contact Material | High Copper Alloy | |
| Row Pitch | 3mm | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | No | |
| Voltage | 600Vrms | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Product Type PCB Header | ||
Series Micro-Fit | ||
Current 13A | ||
Pitch 3mm | ||
Number of Contacts 2 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Micro Fit Connector System | ||
Mount Type Through Hole | ||
Contact Plating Matt Tin | ||
Contact Material High Copper Alloy | ||
Row Pitch 3mm | ||
Termination Type Solder | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals No | ||
Voltage 600Vrms | ||
- COO (Country of Origin):
- CN
The Molex Product SPEC covers the Micro-Fit Plus 3.00 mm centerline Wire to Board connector system with gold and tin plating. Receptacle are terminated with 16 to 30 AWG wire using crimp technology.
Micro-Fit+ connector is a wire-to-board system
Higher-current rating of 12.5A
Superior design options for flexibility and efficient assembly
Unique keying design
Fully polarized housings
Reduces labor costs, saves time and resources
Enhanced TPA design
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