Samtec SEAM Series Straight Surface PCB Header, 300 Contact(s), 1.27 mm Pitch, 6 Row, Shrouded
- RS庫存編號:
- 224-8322
- 製造零件編號:
- SEAM-50-02.0-L-06-2-A-GP-K-TR
- 製造商:
- Samtec
可享批量折扣
小計（1 卷，共 175 件）*
TWD109,795.00
(不含稅)
TWD115,284.75
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2026年1月26日 發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每卷* |
|---|---|---|
| 175 - 700 | TWD627.40 | TWD109,795.00 |
| 875 + | TWD608.50 | TWD106,487.50 |
* 參考價格
- RS庫存編號:
- 224-8322
- 製造零件編號:
- SEAM-50-02.0-L-06-2-A-GP-K-TR
- 製造商:
- Samtec
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Samtec | |
| Product Type | PCB Header | |
| Series | SEAM | |
| Current | 2.7A | |
| Pitch | 1.27mm | |
| Number of Contacts | 300 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Rows | 6 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Board-to-Board | |
| Mount Type | Surface | |
| Contact Material | Copper Alloy | |
| Contact Plating | Silver, Tin | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 1.27mm | |
| Maximum Operating Temperature | 125°C | |
| Contact Gender | Male | |
| Standards/Approvals | No | |
| Voltage | 240 V | |
| 選取全部 | ||
|---|---|---|
品牌 Samtec | ||
Product Type PCB Header | ||
Series SEAM | ||
Current 2.7A | ||
Pitch 1.27mm | ||
Number of Contacts 300 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Rows 6 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Board-to-Board | ||
Mount Type Surface | ||
Contact Material Copper Alloy | ||
Contact Plating Silver, Tin | ||
Termination Type Solder | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 1.27mm | ||
Maximum Operating Temperature 125°C | ||
Contact Gender Male | ||
Standards/Approvals No | ||
Voltage 240 V | ||
不適用
The Samtec SEARAY SEAM series is an open-pin-field array PCB header which has 1.27 mm pitch. It maximizes design and routing flexibility for single-ended or differential pair configurations, and for power, signal, or ground. It uses the edge rate contact system which is designed for applications requiring high-mating cycles and 56 Gbps PAM4 performance.
Lower insertion/withdrawal forces
Solder charge termination
Maximum grounding & routing flexibility
Stack heights from 7 mm to 18.5 mm
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