Molex 54722 Series Vertical Surface Header, 24 Contact(s), 0.5 mm Pitch, 2 Row, Shrouded
- RS庫存編號:
- 816-398
- 製造零件編號:
- 54722-0244
- 製造商:
- Molex
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- RS庫存編號:
- 816-398
- 製造零件編號:
- 54722-0244
- 製造商:
- Molex
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Series | 54722 | |
| Product Type | Header | |
| Current | 500mA | |
| Pitch | 0.5mm | |
| Number of Contacts | 24 | |
| Housing Material | High Temperature Thermoplastic | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface | |
| Connector System | Board-to-Board | |
| Contact Plating | Gold | |
| Contact Material | Phosphor Bronze | |
| Termination Type | Surface Mount | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Contact Gender | Female | |
| Standards/Approvals | RoHS | |
| Voltage | 50V | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Series 54722 | ||
Product Type Header | ||
Current 500mA | ||
Pitch 0.5mm | ||
Number of Contacts 24 | ||
Housing Material High Temperature Thermoplastic | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface | ||
Connector System Board-to-Board | ||
Contact Plating Gold | ||
Contact Material Phosphor Bronze | ||
Termination Type Surface Mount | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Contact Gender Female | ||
Standards/Approvals RoHS | ||
Voltage 50V | ||
- COO (Country of Origin):
- CN
The Molex receptacle offers a robust and reliable solution for board-to-board connectivity. is designed for efficient signal transmission, it features a slim profile suitable for modern electronic applications.
0.50mm pitch provides Compact layout while maintaining signal integrity
Dual row configuration supports up to 24 circuits for versatile applications
Surface mount design ensures easy integration onto PCBs
Gold plating with nickel barrier enhances durability and performance
Operating temperature range of -40° to +105°C for varied environmental conditions
Embossed tape packaging allows for automated assembly processes
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