Molex 54722 Series Vertical Surface Header, 24 Contact(s), 0.5 mm Pitch, 2 Row, Shrouded
- RS庫存編號:
- 816-398
- 製造零件編號:
- 54722-0244
- 製造商:
- Molex
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- RS庫存編號:
- 816-398
- 製造零件編號:
- 54722-0244
- 製造商:
- Molex
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Product Type | Header | |
| Series | 54722 | |
| Current | 500mA | |
| Pitch | 0.5mm | |
| Housing Material | High Temperature Thermoplastic | |
| Number of Contacts | 24 | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Board-to-Board | |
| Mount Type | Surface | |
| Contact Plating | Gold | |
| Contact Material | Phosphor Bronze | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Surface Mount | |
| Maximum Operating Temperature | 105°C | |
| Contact Gender | Female | |
| Standards/Approvals | RoHS | |
| Voltage | 50V | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Product Type Header | ||
Series 54722 | ||
Current 500mA | ||
Pitch 0.5mm | ||
Housing Material High Temperature Thermoplastic | ||
Number of Contacts 24 | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Board-to-Board | ||
Mount Type Surface | ||
Contact Plating Gold | ||
Contact Material Phosphor Bronze | ||
Minimum Operating Temperature -40°C | ||
Termination Type Surface Mount | ||
Maximum Operating Temperature 105°C | ||
Contact Gender Female | ||
Standards/Approvals RoHS | ||
Voltage 50V | ||
- COO (Country of Origin):
- CN
The Molex receptacle offers a robust and reliable solution for board-to-board connectivity. is designed for efficient signal transmission, it features a slim profile suitable for modern electronic applications.
0.50mm pitch provides Compact layout while maintaining signal integrity
Dual row configuration supports up to 24 circuits for versatile applications
Surface mount design ensures easy integration onto PCBs
Gold plating with nickel barrier enhances durability and performance
Operating temperature range of -40° to +105°C for varied environmental conditions
Embossed tape packaging allows for automated assembly processes
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