TE Connectivity AMP Universal Power Series Vertical Through Hole PCB Header, 5 Contact(s), 3.96 mm Pitch, 1 Row,
- RS庫存編號:
- 797-448
- 製造零件編號:
- 4-178488-1
- 製造商:
- TE Connectivity
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- RS庫存編號:
- 797-448
- 製造零件編號:
- 4-178488-1
- 製造商:
- TE Connectivity
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | TE Connectivity | |
| Product Type | PCB Header | |
| Series | AMP Universal Power | |
| Current | 10A | |
| Pitch | 3.96mm | |
| Number of Contacts | 5 | |
| Housing Material | Glass Filled 6/6 Nylon | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Material | Brass | |
| Contact Plating | Tin | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -30°C | |
| Tail Pin Length | 3.8mm | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | UL | |
| Voltage | 50V ac | |
| 選取全部 | ||
|---|---|---|
品牌 TE Connectivity | ||
Product Type PCB Header | ||
Series AMP Universal Power | ||
Current 10A | ||
Pitch 3.96mm | ||
Number of Contacts 5 | ||
Housing Material Glass Filled 6/6 Nylon | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Material Brass | ||
Contact Plating Tin | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -30°C | ||
Tail Pin Length 3.8mm | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals UL | ||
Voltage 50V ac | ||
- COO (Country of Origin):
- CN
The TE Connectivity PCB Mount Header offers reliable vertical connection for wire-to-board applications. Designed for five positions, this header ensures secure electrical interfaces in various electronic circuits.
Offers a fully shrouded design for enhanced protection
Features a 3.96 mm and 7.92 mm centreline for versatile mounting options
Supports operating voltages of up to 300 VAC, making it suitable for diverse applications
Constructed from Durable Nylon 6/6 GF for robust performance in challenging environments
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