Molex 43045 Series Straight Surface Mount PCB Header, 2 Contact(s), 3.00 mm Pitch, 2 Row, Shrouded
- RS庫存編號:
- 795-333
- 製造零件編號:
- 43045-0215
- 製造商:
- Molex
N
小計（1 卷，共 200 件）*
TWD10,927.00
(不含稅)
TWD11,473.35
(含稅)
訂單超過 $1,300.00 免費送貨
新產品 - 立即預訂
- 從 2026年9月22日 發貨
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卷 | 每卷 | 每單位* |
|---|---|---|
| 1 + | TWD10,927.00 | TWD54.635 |
* 參考價格
- RS庫存編號:
- 795-333
- 製造零件編號:
- 43045-0215
- 製造商:
- Molex
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Product Type | PCB Header | |
| Series | 43045 | |
| Pitch | 3.00mm | |
| Current | 8.5A | |
| Number of Contacts | 2 | |
| Housing Material | High Temperature Thermoplastic | |
| Number of Rows | 2 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface Mount | |
| Contact Material | Brass | |
| Contact Plating | Tin | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Surface Mount | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | UL | |
| Voltage | 600V | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Product Type PCB Header | ||
Series 43045 | ||
Pitch 3.00mm | ||
Current 8.5A | ||
Number of Contacts 2 | ||
Housing Material High Temperature Thermoplastic | ||
Number of Rows 2 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface Mount | ||
Contact Material Brass | ||
Contact Plating Tin | ||
Minimum Operating Temperature -40°C | ||
Termination Type Surface Mount | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals UL | ||
Voltage 600V | ||
- COO (Country of Origin):
- CN
The Molex vertical header facilitates reliable power and connectivity in Compact applications, featuring a dual-row design with two circuits and a 3.00mm pitch for efficient space utilisation.
Current rating of 8.5A per contact ensuring robust performance
Glow-wire capable, compliant with IEC standards for enhanced safety
Constructed with high-temperature thermoplastic for durability under extreme conditions
Designed for surface mount termination, maximising board space efficiency
Vertical orientation provides a Compact footprint for application flexibility
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