Molex 105309 Series Vertical Through Hole PCB Header, 7 Contact(s), 2.5 mm Pitch, 1 Row, Shrouded
- RS庫存編號:
- 787-618
- 製造零件編號:
- 105309-1307
- 製造商:
- Molex
N
小計（1 袋，共 100 件）*
TWD10,999.00
(不含稅)
TWD11,548.95
(含稅)
訂單超過 $1,300.00 免費送貨
新產品 - 立即預訂
- 從 2026年9月16日 發貨
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袋 | 每袋 | 每單位* |
|---|---|---|
| 1 + | TWD10,999.00 | TWD109.99 |
* 參考價格
- RS庫存編號:
- 787-618
- 製造零件編號:
- 105309-1307
- 製造商:
- Molex
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Product Type | PCB Header | |
| Series | 105309 | |
| Current | 8A | |
| Pitch | 2.5mm | |
| Housing Material | Polymer | |
| Number of Contacts | 7 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Material | Brass | |
| Contact Plating | Gold | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Contact Gender | Female | |
| Voltage | 250V | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Product Type PCB Header | ||
Series 105309 | ||
Current 8A | ||
Pitch 2.5mm | ||
Housing Material Polymer | ||
Number of Contacts 7 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Material Brass | ||
Contact Plating Gold | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Contact Gender Female | ||
Voltage 250V | ||
- COO (Country of Origin):
- CN
The Molex Connector is a Compact and efficient connection solution featuring a vertical header design suited for tight spaces while ensuring reliable electrical performance across applications.
Kinked pins enhance retention in PCB applications
Designed for a 2.50mm pitch, optimising space usage
Plated with 0.76μm gold for improved conductivity and corrosion resistance
Glow-wire capable for increased safety in high-temperature environments
Available in tray packaging for streamlined integration into assembly processes
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