Molex 42002 Series Vertical Through Hole PCB Header, 15 Contact(s), 6.35 mm Pitch, 3 Row, Unshrouded
- RS庫存編號:
- 787-138
- 製造零件編號:
- 10-84-4150
- 製造商:
- Molex
N
小計（1 托盤，共 200 件）*
TWD13,237.00
(不含稅)
TWD13,898.85
(含稅)
訂單超過 $1,300.00 免費送貨
新產品 - 立即預訂
- 從 2026年12月24日 發貨
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托盤 | 每托盤 | 每單位* |
|---|---|---|
| 1 + | TWD13,237.00 | TWD66.185 |
* 參考價格
- RS庫存編號:
- 787-138
- 製造零件編號:
- 10-84-4150
- 製造商:
- Molex
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產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Series | 42002 | |
| Product Type | PCB Header | |
| Current | 20A | |
| Pitch | 6.35mm | |
| Number of Contacts | 15 | |
| Housing Material | Nylon | |
| Number of Rows | 3 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Plating | Tin | |
| Contact Material | Bronze | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -55°C | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | UL | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Series 42002 | ||
Product Type PCB Header | ||
Current 20A | ||
Pitch 6.35mm | ||
Number of Contacts 15 | ||
Housing Material Nylon | ||
Number of Rows 3 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Plating Tin | ||
Contact Material Bronze | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -55°C | ||
Contact Gender Male | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals UL | ||
- COO (Country of Origin):
- IN
The Molex Header features a reliable connection system designed for PCB applications, ensuring seamless integration within various electronic devices while maintaining optimal performance standards.
Enhanced durability through high-quality materials for improved longevity
Compact design facilitates integration into space-constrained environments
Versatile connector types accommodate diverse application requirements
Designed to support high-speed data transmissions with minimal signal degradation
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