Molex 203556 Series Vertical Surface PCB Header, 4 Contact(s), 1 mm Pitch, 1 Row, Shrouded
- RS庫存編號:
- 786-079
- 製造零件編號:
- 203556-0407
- 製造商:
- Molex
N
小計（1 卷，共 1100 件）*
TWD65,311.00
(不含稅)
TWD68,576.55
(含稅)
訂單超過 $1,300.00 免費送貨
製造商存貨
- 準備從 2026年12月18日 起發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
卷 | 每卷 | 每單位* |
|---|---|---|
| 1 + | TWD65,311.00 | TWD59.374 |
* 參考價格
- RS庫存編號:
- 786-079
- 製造零件編號:
- 203556-0407
- 製造商:
- Molex
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Product Type | PCB Header | |
| Series | 203556 | |
| Pitch | 1mm | |
| Housing Material | Polyamide | |
| Number of Contacts | 4 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface | |
| Connector System | Wire-to-Board | |
| Contact Plating | Gold | |
| Contact Material | Bronze | |
| Termination Type | Surface Mount | |
| Row Pitch | 1mm | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Voltage | 100V | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Product Type PCB Header | ||
Series 203556 | ||
Pitch 1mm | ||
Housing Material Polyamide | ||
Number of Contacts 4 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface | ||
Connector System Wire-to-Board | ||
Contact Plating Gold | ||
Contact Material Bronze | ||
Termination Type Surface Mount | ||
Row Pitch 1mm | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Voltage 100V | ||
- COO (Country of Origin):
- VN
The Molex PCB Header is designed to deliver reliable electrical connections in diverse applications. Its Compact form factor makes it Ideal for use in space-constrained environments.
1.00mm pitch design enables efficient space utilisation on PCBs
Friction lock feature ensures secure connections, reducing the risk of disconnection
Gold plating of 0.38μm enhances conductivity and corrosion resistance
Single-row configuration simplifies installation and reduces complexity
Surface mount capability streamlines assembly and integration into electronic devices
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