Molex 214721 Series Right Angle Surface PCB Header, 6 Contact(s), 0.8 mm Pitch, 1 Row, Shrouded
- RS庫存編號:
- 785-605
- 製造零件編號:
- 214721-0061
- 製造商:
- Molex
N
小計（1 卷，共 5000 件）*
TWD330,935.00
(不含稅)
TWD347,481.75
(含稅)
訂單超過 $1,300.00 免費送貨
製造商存貨
- 準備從 2026年12月10日 起發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
卷 | 每卷 | 每單位* |
|---|---|---|
| 1 + | TWD330,935.00 | TWD66.187 |
* 參考價格
- RS庫存編號:
- 785-605
- 製造零件編號:
- 214721-0061
- 製造商:
- Molex
規格
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產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Series | 214721 | |
| Product Type | PCB Header | |
| Pitch | 0.8mm | |
| Current | 2.5A | |
| Number of Contacts | 6 | |
| Housing Material | Polyamide | |
| Number of Rows | 1 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface | |
| Connector System | Wire-to-Board | |
| Contact Plating | Gold | |
| Contact Material | Brass | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Surface Mount | |
| Contact Gender | Female | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | UL | |
| Voltage | 30V | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Series 214721 | ||
Product Type PCB Header | ||
Pitch 0.8mm | ||
Current 2.5A | ||
Number of Contacts 6 | ||
Housing Material Polyamide | ||
Number of Rows 1 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface | ||
Connector System Wire-to-Board | ||
Contact Plating Gold | ||
Contact Material Brass | ||
Minimum Operating Temperature -40°C | ||
Termination Type Surface Mount | ||
Contact Gender Female | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals UL | ||
Voltage 30V | ||
- COO (Country of Origin):
- KR
The Molex PCB Header is designed for seamless electronic interconnections. Its primary function is to enable reliable connections in a Compact format, facilitating efficient circuit design.
High-performance connectors suitable for demanding applications
Robust design enhances signal integrity and durability
Versatile compatibility with multiple interconnection environments
Compact form factor optimises space utilisation on PCBs
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