Molex 87832 Series Vertical Surface Mount PCB Header, 14 Contact(s), 2 mm Pitch, 2 Row, Shrouded

小計(1 卷,共 500 件)*

TWD18,696.00

(不含稅)

TWD19,630.80

(含稅)

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  • 2026年6月29日 發貨
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RS庫存編號:
694-213
製造零件編號:
87832-5662
製造商:
Molex
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品牌

Molex

Series

87832

Product Type

PCB Header

Pitch

2mm

Current

2A

Housing Material

Nylon

Number of Contacts

14

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Surface Mount

Connector System

Wire-to-Board

Contact Plating

Gold

Contact Material

Phosphor Bronze

Minimum Operating Temperature

-55°C

Termination Type

Surface Mount

Contact Gender

Male

Maximum Operating Temperature

105°C

Standards/Approvals

CSA, EU RoHS, UL

Voltage

125V

COO (Country of Origin):
MY
The Molex Milli Grid PCB header is expertly designed for high-performance wire-to-board applications, providing reliable connectivity with its dual-row, vertical configuration. Featuring a Compact 2.00mm pitch, this product ensures optimal space utilisation on PCB designs while delivering strong, Durable contacts. With lead-free component construction, it meets stringent environmental regulations, including EU RoHS compliance. This header boasts a unique locking mechanism with centre polarization and PCB locator for easy, accurate alignment during assembly, assuring robustness in demanding operational environments. Ideal for a wide array of applications, it incorporates 14 circuits, making it a versatile choice for modern electronic devices.

Durable design supports a maximum current of 2.0A, suitable for power-sensitive applications
Vertical surface mount provides efficient space-saving on PCBs
Locking windows and keying features enhance connection reliability during mating
Constructed from lead-free materials, complying with environmental standards
Durability promise of 100 mating cycles to maintain performance over time
Flame retardant resin (94V-0) ensures safety under operational conditions
Fully shrouded design protects pins and aids in correct mating
Embossed tape on reel packaging facilitates automated assembly processes

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