Molex 70543 Series Vertical Through Hole Header, 8 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

N

小計(1 管,共 150 件)*

TWD9,271.00

(不含稅)

TWD9,734.55

(含稅)

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  • 2026年4月13日 發貨
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每管
每單位*
1 +TWD9,271.00TWD61.807

* 參考價格

RS庫存編號:
694-035
製造零件編號:
70543-0112
製造商:
Molex
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品牌

Molex

Series

70543

Product Type

Header

Current

3A

Pitch

2.54mm

Number of Contacts

8

Housing Material

High Temperature Thermoplastic

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Contact Material

Brass and Phosphor Bronze

Contact Plating

Gold

Minimum Operating Temperature

-40°C

Termination Type

Solder

Maximum Operating Temperature

105°C

Tail Pin Length

3.3mm

Standards/Approvals

RoHS Compliant

Voltage

250V

COO (Country of Origin):
MY
The Molex SL header is designed for seamless wire-to-board connections, featuring a 2.54mm pitch and a vertical orientation. Engineered for reliability, this single-row header accommodates up to 8 circuits with a robust construction that includes a shrouded design for added protection. Optimised for performance, it boasts a gold selective plating of 0.76μm on the contacts, ensuring excellent conductivity and resilience under varying operational conditions, while the tin plating on the PC tail furthers its durability. This component serves a wide range of applications, making it Ideal for both industrial and commercial electronics.

Constructed from high-temperature thermoplastic for enhanced heat resistance

Locking mechanism ensures secure mating and prevents accidental disengagement

Rated for a maximum electrical current of 3.0A, catering to various power demands

Compatible with lead-free solder processes, supporting eco-friendly assembly

Durable design allows for up to 50 mating cycles, ensuring longevity in use

Full shrouding protects against misalignment and facilitates reliable connections

Black resin colour for a sleek appearance and added UV protection

Designed with a recommended PCB thickness of 1.60mm for optimal integration

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