Molex 87263 Series Vertical Surface Mount Header, 14 Contact(s), 2 mm Pitch, 2 Row, Unshrouded
- RS庫存編號:
- 693-441
- 製造零件編號:
- 87263-1423
- 製造商:
- Molex
小計(1 管,共 120 件)*
TWD10,897.00
(不含稅)
TWD11,441.85
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2026年3月31日 發貨
**需要更多嗎?**輸入您需要的數量,然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
管 | 每管 | 每單位* |
|---|---|---|
| 1 + | TWD10,897.00 | TWD90.808 |
* 參考價格
- RS庫存編號:
- 693-441
- 製造零件編號:
- 87263-1423
- 製造商:
- Molex
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Product Type | Header | |
| Series | 87263 | |
| Pitch | 2mm | |
| Housing Material | High Temperature Thermoplastic | |
| Number of Contacts | 14 | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Surface Mount | |
| Contact Material | Gold | |
| Contact Plating | Gold | |
| Termination Type | Surface Mount | |
| Standards/Approvals | UL Rated 94V-0 | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Product Type Header | ||
Series 87263 | ||
Pitch 2mm | ||
Housing Material High Temperature Thermoplastic | ||
Number of Contacts 14 | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Connector System Wire-to-Board | ||
Mount Type Surface Mount | ||
Contact Material Gold | ||
Contact Plating Gold | ||
Termination Type Surface Mount | ||
Standards/Approvals UL Rated 94V-0 | ||
- COO (Country of Origin):
- SG
The Molex Entry receptacle is meticulously designed to provide efficient connectivity in Compact electronic applications. With a robust circuit size of 14 and a standard height of 6.00 mm, this component ensures reliable performance while maintaining a minimal footprint. It features selective gold plating at the contact area, enhancing durability and conductivity, which is essential for optimal signal transmission. The part is constructed from high-temperature thermoplastic, rated for UL 94V-0, making it well-suited for surface-mount soldering processes. Its thoughtful design also accommodates a cap for moisture barrier protection, ensuring longevity and reliability in demanding environments.
Compact design optimises space within electronic assemblies
Robust 14 circuit size supports versatile applications
Selective gold plating increases longevity and electrical performance
High-temperature thermoplastic construction withstands harsh soldering processes
Moisture barrier packaging protects components during transport and storage
Enhanced co-planarity of P.C. tail facilitates easy integration into PCBs
UL-rated materials ensure compliance with safety standards
Robust 14 circuit size supports versatile applications
Selective gold plating increases longevity and electrical performance
High-temperature thermoplastic construction withstands harsh soldering processes
Moisture barrier packaging protects components during transport and storage
Enhanced co-planarity of P.C. tail facilitates easy integration into PCBs
UL-rated materials ensure compliance with safety standards
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